The **G3B15AP-R-XC** is a high-quality, subminiature push-button switch manufactured by **NKK Switches**. It belongs to the **G3B series**, which is known for its surface-mount (SMD) compatibility and high reliability in low-logic applications. --- ### 1. Key Technical Specifications The following table summarizes the primary electrical and mechanical characteristics of the device: | Feature | Specification | | :--- | :--- | | **Circuit** | SPDT (Single Pole Double Throw) | | **Switch Function** | ON - (ON) *Note: ( ) indicates momentary* | | **Current Rating** | 0.4VA maximum @ 28V AC/DC maximum | | **Contact Resistance** | 80 milliohms maximum | | **Insulation Resistance** | 500 Megohms minimum @ 500V DC | | **Dielectric Strength** | 500V AC minimum for 1 minute | | **Mechanical Life** | 50,000 operations minimum | | **Operating Force** | 2.04 N (Newtons) | --- ### 2. Breakdown of the Model Number The part number can be decoded to understand its physical configuration: * **G3B**: Series identifier (Process Compatible Subminiature Pushbuttons). * **15**: Circuit code for SPDT (Single Pole Double Throw). * **A**: Actuator type (Plunger). * **P**: Terminal type (Straight PC Terminals - though often used in SMD layouts for this series). * **R**: Packaging (Typically refers to Tape & Reel for automated assembly). * **XC**: This suffix usually denotes specific material or aesthetic options, often a **red cap** or a specific accessory color/material. --- ### 3. Structural and Material Features * **Logic Level Rating**: The 0.4VA rating indicates this switch is designed specifically for "dry circuits" (logic level). It uses **Gold-plated contacts** to prevent oxidation and ensure a reliable connection at low voltages. * **Process Sealed**: The device is constructed to withstand automated soldering processes, including infrared (IR) convection reflow and vapor phase soldering. It is typically washable. * **Heat Resistant Resin**: The housing is made of high-temperature polyphenylene sulfide (PPS) or similar high-performance resin to survive extreme soldering temperatures. * **Gull-wing Terminals**: This specific version is designed for Surface Mount Technology (SMT), allowing for efficient PCB space utilization. --- ### 4. Typical Applications Due to its small footprint and high reliability, the G3B15AP-R-XC is commonly found in: * Handheld medical devices. * Telecommunications equipment. * Industrial automation control panels. * Consumer electronics requiring high-density PCB layouts.