The **G3B25AH-R-YC** is a specific part number for a high-quality, subminiature push-button switch manufactured by **NKK Switches**. It belongs to the **G3B Series**, which is known for being process-sealed and designed for surface mount (SMT) applications. --- ### 1. Technical Specifications Breakdown The part number can be decoded to understand its specific electronic and mechanical characteristics: | Feature | Specification | | :--- | :--- | | **Series** | G3B Series (Subminiature Antistatic Pushbuttons) | | **Circuit / Pole** | DPDT (Double Pole Double Throw) | | **Switch Function** | ON - (ON) — *Parenthesis indicates Momentary action* | | **Actuator Type** | 3.8mm Diameter Plunger | | **Terminal Type** | Right Angle Surface Mount (SMT) | | **Contact Material** | Gold plated (Ideal for logic-level signals) | | **Electrical Capacity** | 0.4VA Max @ 28V AC/DC Max | | **Operating Force** | 2.04 N (Newtons) | --- ### 2. Key Electronic Features #### A. Logic Level Compatibility Because the contacts are gold-plated, this switch is specifically designed for **logic-level circuits**. Unlike silver contacts, gold does not require a "cleansing arc" to break through oxidation, making it highly reliable for low-voltage, low-current signals (milliamps). #### B. Process Sealed Construction The switch features an internal o-ring and a sealed base. This allows the component to withstand **automated wave soldering** and **rigorous cleaning processes** (like alcohol-based solvents) without internal contamination. #### C. Antistatic Design The G3B series is engineered with high dielectric strength and carbon-filled actuators or bushings to dissipate static electricity, protecting sensitive CMOS devices on the PCB. --- ### 3. Physical Dimensions & Mounting * **Size:** Extremely small footprint, saving PCB real estate. * **Heat Resistance:** The housing is made of high-heat resistant resin (such as Polyphenylene Sulfide), allowing it to survive infrared (IR) reflow soldering temperatures. * **Packaging (-YC):** The "YC" suffix typically refers to the packaging method, often indicating **Tape and Reel** packaging for automated pick-and-place assembly. --- ### 4. Common Applications * Handheld medical devices. * Telecommunications equipment. * High-end consumer electronics (Reset or Mode buttons). * Test and measurement instrumentation.