The **H5TC4G43BFR-RDA** is a high-performance, low-voltage synchronous dynamic random-access memory (DRAM) manufactured by **SK hynix**. It belongs to the DDR3L (DDR3 Low Voltage) SDRAM family. --- ## 1. Technical Specifications The part number can be broken down into specific technical parameters that define its operation. | Parameter | Specification | | :--- | :--- | | **Density** | 4 Gigabits (512 Megabytes) | | **Technology** | DDR3L SDRAM (Low Voltage) | | **Organization** | 128M x 32 (Internal 8-bank architecture) | | **Voltage (VDD/VDDQ)** | 1.35V (Backward compatible to 1.5V) | | **Speed Grade** | DDR3-1600 (PC3L-12800) | | **Clock Frequency** | 800 MHz | | **Data Rate** | 1600 MT/s (Mega-transfers per second) | | **CAS Latency (CL)** | 11 Cycles | | **Package Type** | 96-ball FBGA (Fine pitch Ball Grid Array) | | **Operating Temp** | 0°C to 95°C (Commercial Grade) | --- ## 2. Key Features * **Low Power Consumption:** Operates at 1.35V, providing approximately 20% power savings over standard 1.5V DDR3 memory. * **Bi-directional Differential Data Strobe:** Used for data capturing at both the rising and falling edges of the clock. * **8-bit Prefetch Architecture:** Allows high-speed data transfer. * **On-Die Termination (ODT):** Improves signal integrity by terminating the data signal within the chip itself. * **ZT (Z-Termination) Calibration:** Automatically calibrates the output driver impedance and ODT values. --- ## 3. Pinout and Physical Interface As a **96-ball FBGA** component, the physical interface is designed for high-density surface mount technology (SMT). ### Connection Groups 1. **Address Pins (A0-A14):** Used to provide the row and column addresses. 2. **Data Pins (DQ0-DQ31):** Bi-directional data bus for reading and writing. 3. **Command Pins:** Includes `RAS#` (Row Address Strobe), `CAS#` (Column Address Strobe), and `WE#` (Write Enable). 4. **Differential Clocks (CK, CK#):** All control and address input signals are sampled on the crossing of the positive edge of CK and the negative edge of CK#. --- ## 4. Typical Applications This specific chip is commonly found in: * **Laptops and Ultrabooks:** Where low power consumption is critical for battery life. * **Embedded Systems:** Industrial PCs, routers, and networking equipment. * **Single Board Computers (SBCs):** High-end ARM-based processing boards. * **Graphics Cards:** Lower-mid tier GPUs requiring DDR3 memory buffers.