The **HMLQ20161T-R47MDR** is a specific part number for a surface-mount (SMD) power inductor. This component is typically used in power management circuits, such as DC-DC converters, particularly in compact devices like smartphones, tablets, and wearables. ### 1. Part Number Breakdown Based on standard industry naming conventions for this series (often produced by manufacturers like Chilisin or Cyntec), here is the technical breakdown: | Code Segment | Meaning | Description | | :--- | :--- | :--- | | **HMLQ** | Series Name | High-current, Molded Low Profile Inductor (Metal Alloy). | | **2016** | Dimensions | Package size: **2.0mm x 1.6mm**. | | **1T** | Height/Type | Indicates a thickness (usually ~1.0mm). | | **R47** | Inductance | **0.47 µH** (Microhenries). | | **M** | Tolerance | **±20%** tolerance. | | **DR** | Packaging/Internal | Typically refers to Tape & Reel packaging and specific internal construction. | --- ### 2. Technical Specifications While exact values can vary slightly by manufacturer, the general specifications for an R47 (0.47µH) inductor in this 2016 size are: * **Inductance:** 0.47 µH * **DC Resistance (DCR):** Low (typically between 20mΩ to 35mΩ) to minimize power loss. * **Saturation Current (Isat):** High (approx. 4.0A to 5.5A). This is the current at which the inductance drops by a certain percentage. * **Heat Rating Current (Irms):** High (approx. 3.5A to 4.5A). This is the current that causes a specific temperature rise (usually 40°C). * **Operating Temperature:** -55°C to +125°C. --- ### 3. Key Features and Construction 1. **Metal Alloy Molding:** Unlike traditional wire-wound inductors with ferrite cores, this part uses a metal powder molding technology. This allows for: * **Soft Saturation:** The inductance drops gradually rather than abruptly when current increases. * **Magnetic Shielding:** Lower Electromagnetic Interference (EMI) leakage. 2. **Compact Footprint:** The 2016 (metric) size is ideal for high-density PCB layouts. 3. **High Efficiency:** Designed for high-frequency switching regulators where low DCR is critical for battery life. --- ### 4. Common Applications * **DC/DC Converters:** Point-of-load (POL) power supplies. * **Mobile Devices:** Power management ICs (PMICs) for CPUs or GPUs in smartphones. * **IoT Modules:** Compact wireless sensors requiring efficient power conversion. ---