The **LSMT2-10061-R** is a high-performance, surface-mount (SMT) power inductor typically used in DC-DC converter applications. It is part of a series known for its compact size, low profile, and high current-handling capabilities. --- ### ## Technical Specifications The following table outlines the typical electrical and physical characteristics for this component: | Parameter | Typical Value | | :--- | :--- | | **Inductance** | 1.0 µH (±20%) | | **DC Resistance (DCR)** | ~5.8 mΩ (Max) | | **Saturation Current (Isat)** | ~12.0 A | | **Heating Current (Irms)** | ~10.5 A | | **Operating Temperature** | -40°C to +125°C | | **Package Size** | 10.0 x 6.0 x 1.2 mm (Approx.) | | **Mounting Type** | Surface Mount (SMD/SMT) | --- ### ### Key Features 1. **Low Profile Design:** The "10061" designation often refers to the footprint dimensions (approx. 10mm x 6mm). Its low height makes it ideal for thin electronics like tablets and ultra-portable laptops. 2. **Magnetic Shielding:** These inductors are usually shielded to minimize Electromagnetic Interference (EMI), which is critical for densely packed circuit boards. 3. **High Current Saturation:** Designed to handle high peak currents without the inductance dropping significantly, ensuring stability in power supplies. 4. **Low DCR:** Low DC resistance minimizes power loss through heat, increasing the overall efficiency of the power management system. --- ### ### Common Applications * **DC-DC Converters:** Used in Buck, Boost, or Buck-Boost topologies. * **Power Management Integrated Circuits (PMICs):** For voltage regulation in mobile devices. * **Computing:** Graphics cards, servers, and high-performance motherboards. * **Battery Powered Equipment:** Where high efficiency is required to extend battery life. --- ### ### Sample Footprint Recommendation (Generic) ```markdown Top View Dimensions: [ L: 10.0mm ] x [ W: 6.0mm ] Height (H): 1.2mm Max Recommended Solder Pad Layout: - Pad Width: 3.0mm - Pad Length: 6.5mm - Gap between Pads: 4.5mm ```