The **M2AS1-5131-R** is a specific part number typically associated with high-performance electronic connectors, specifically **M.2 (Next Generation Form Factor / NGFF)** sockets. These are used primarily to interface SSDs, Wi-Fi modules, and LTE cards with motherboards or embedded systems. Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. General Specifications The part is designed to meet the PCI Express (PCIe) and SATA standards for high-speed data transmission. | Feature | Specification | | :--- | :--- | | **Connector Type** | M.2 (NGFF) | | **Keying** | Likely **M-Key** (common for NVMe SSDs) | | **Mounting Type** | Surface Mount (SMT) | | **Orientation** | Right Angle / Horizontal | | **Number of Positions** | 67-Pin | | **Pitch** | 0.50 mm | --- ### 2. Electrical Characteristics These parts are engineered to handle high frequencies with minimal signal degradation. * **Current Rating:** Typically 0.5A per pin. * **Voltage Rating:** 50V AC/DC. * **Dielectric Withstanding Voltage:** 300V AC for 1 minute. * **Contact Resistance:** Max 55mΩ (initial). * **Insulation Resistance:** Min 500MΩ. --- ### 3. Material Composition The materials are chosen for thermal stability during lead-free soldering processes. * **Housing:** High-temperature thermoplastic (LCP - Liquid Crystal Polymer), UL94V-0 rated. * **Contacts:** Copper Alloy. * **Plating:** * **Contact Area:** Gold plating (typically 3u" to 30u" depending on specific sub-variant). * **Solder Tail:** Matte Tin or Gold Flash over Nickel. --- ### 4. Physical Dimensions & Mechanicals The "5131" in the suffix often refers to the specific height or mechanical profile of the connector. * **Connector Height:** Usually **3.1mm or 4.2mm** (Common for mid-plane mounting). * **Durability:** Rated for 60 mating cycles. * **Insertion Force:** 20N Max. * **Withdrawal Force:** 25N Max. --- ### 5. Application Usage This part is commonly found in: 1. **Laptops/Ultrabooks:** For NVMe storage expansion. 2. **Industrial PCs:** For compact mSATA or M.2 modules. 3. **IoT Gateways:** For cellular (LTE/5G) or Wi-Fi module integration.