The **M2AS1-5141-R2/N** is a specific electronic connector component, typically associated with high-speed internal cabling or board-to-board interfaces, often found in server and networking hardware. Below is a detailed breakdown of its electronic characteristics and specifications. --- ### 1. General Component Overview This part is a high-density, small-form-factor connector designed for modern data transmission standards. It is frequently categorized under **SlimSAS** or **Slimline SAS** (Serial Attached SCSI) connector families. | Feature | Specification | | :--- | :--- | | **Product Category** | Internal High-Speed Connector | | **Interface Standard** | SAS 4.0 / PCIe Gen 4 (and Gen 5 compatible) | | **Connector Type** | SlimSAS 8i (Vertical/Right Angle depending on suffix) | | **Pin Count** | 74 Positions (Standard for 8i configurations) | | **Pitch** | 0.6mm | --- ### 2. Key Technical Specifications The electronic integrity of this part is defined by its ability to handle high-frequency signals with minimal loss. * **Signal Integrity:** Designed to support data rates up to **24Gbps** (SAS 4.0) or **16GT/s per lane** (PCIe Gen 4). * **Impedance:** Typically rated for **85 Ohms** (optimized for PCIe) or **100 Ohms** (standard differential signaling). * **Contact Resistance:** Maximum of 20mΩ to 30mΩ to ensure stable power and data flow. * **Current Rating:** Usually 0.5A per pin maximum, as it is primarily a signal connector rather than a power delivery connector. --- ### 3. Physical and Material Composition The "R2/N" suffix often denotes specific revisions or material compliance (such as Halogen-Free or specific RoHS standards). #### Material Table | Part Section | Material / Property | | :--- | :--- | | **Housing** | High-Temperature Thermoplastic (LCP) | | **Contact Material** | Copper Alloy | | **Plating** | Gold (Au) over Nickel (Ni) on contact area | | **Flammability** | UL 94V-0 Rated | --- ### 4. Common Applications These connectors are "electronic bridges" used to link high-speed storage or compute modules within a chassis: 1. **NVMe Storage:** Connecting U.2 or U.3 drives to a motherboard. 2. **RAID Cards:** Interfacing high-performance controllers with backplanes. 3. **HBA (Host Bus Adapters):** Providing high-bandwidth paths for enterprise servers. 4. **Switch Fabric:** Internal routing within networking switches. --- ### 5. Technical Footprint (Mechanical) ```text Connector Footprint Layout (Simplified) [ PINS 1-37 ] <-- Top Row ---------------- [ PINS 38-74 ] <-- Bottom Row (0.6mm spacing between centers) ```