The **M2AS1-5243-R2/CE** is a specialized high-speed connector, typically categorized as an **M.2 (Next Generation Form Factor - NGFF)** interface component. These parts are fundamental in modern computing for connecting SSDs, Wi-Fi cards, and cellular modules to a motherboard or carrier board. --- ### 1. General Specifications While specific internal datasheets are often proprietary to manufacturers (like Foxconn or Lotes), the part number breakdown generally reflects the following electronic characteristics: | Feature | Description | | :--- | :--- | | **Interface Type** | M.2 (NGFF) | | **Keying** | Likely "M-Key" or "B-Key" (Standard for PCIe x4 or SATA SSDs) | | **Mounting Type** | Surface Mount (SMT) | | **Orientation** | Right-Angle / Horizontal | | **Lead-Free Status** | RoHS Compliant (Indicated by "CE" or "R2" suffix) | --- ### 2. Key Electronic Components & Materials The reliability of this connector depends on three main electronic design factors: #### A. Contacts and Plating * **Base Material:** Usually a high-performance copper alloy (Phosphor Bronze or Beryllium Copper). * **Plating:** Gold plating is applied to the contact mating area to ensure low contact resistance and prevent oxidation over high-frequency cycles. * **Underplating:** Nickel barrier layer to prevent copper migration. #### B. Housing (Dielectric) * **Material:** High-temperature thermoplastic (e.g., LCP - Liquid Crystal Polymer). * **Function:** Provides electrical insulation between the high-speed signal pins and must withstand reflow soldering temperatures (up to 260°C). #### C. Signal Integrity Features * **Impedance Matching:** Designed for **100-ohm differential impedance** to support PCIe Gen 3/Gen 4 or SATA 3.0 speeds. * **EMI Shielding:** The metal "shells" or grounding tabs on the sides are soldered to the PCB ground plane to reduce Electromagnetic Interference. --- ### 3. Mechanical & Electrical Ratings | Parameter | Typical Value | | :--- | :--- | | **Current Rating** | 0.5A per pin | | **Voltage Rating** | 50V AC/DC | | **Contact Resistance** | 55 mΩ Max | | **Insulation Resistance** | 500 MΩ Min | | **Durability** | 60 cycles (Standard) | --- ### 4. Application Use Case This part is commonly used in: 1. **Industrial PCs:** For compact storage expansion. 2. **Embedded Systems:** Connecting NVMe modules for high-speed data logging. 3. **Networking Hardware:** Houses M.2 4G/5G LTE modules.