The **M2AS1-6112-R2** is a specialized high-speed connector component, typically part of the **M2 series** manufactured by vendors like **JPC (Japan Pure Chemical)** or similar high-performance interconnect specialists. These parts are primarily used in server, networking, and storage applications to interface with M.2 (NGFF) expansion cards. --- ### 1. Key Technical Specifications The part number breaks down into specific physical and electrical characteristics designed for high-density PCB mounting. | Feature | Specification | | :--- | :--- | | **Connector Type** | M.2 (NGFF - Next Generation Form Factor) | | **Mounting Type** | Surface Mount (SMT) | | **Orientation** | Right Angle / Horizontal | | **Pin Count** | 67-Pin (Standard for M.2) | | **Keying** | M-Key (Commonly for PCIe x4 NVMe SSDs) | | **Height** | 4.2mm (Common standard height for double-sided modules) | | **Plating** | Gold Flash or Selective Gold plating for high conductivity | --- ### 2. Electronic Components & Design The M2AS1-6112-R2 consists of several critical sub-elements that ensure signal integrity: * **Contact Material:** Usually a copper alloy with gold plating over nickel. This minimizes contact resistance and prevents oxidation over long periods. * **Insulator Body:** High-temperature thermoplastic (LCP - Liquid Crystal Polymer). This is necessary to withstand **reflow soldering** temperatures (up to 260°C). * **Solder Pegs/Tabs:** Metal tabs located on the sides of the connector provide mechanical stability, ensuring the connector doesn't rip off the PCB when the M.2 card is inserted or removed. * **Signal Integrity:** Designed to support **PCIe Gen 3 and Gen 4** speeds. The internal lead frames are spaced to minimize crosstalk and impedance mismatch (typically 100-ohm differential). --- ### 3. Application Use Cases This specific connector is found in environments requiring high-speed data transfer: 1. **Industrial PCs:** Providing a slot for NVMe boot drives. 2. **Edge Computing:** Connecting AI acceleration modules or cellular (5G) cards. 3. **Data Center Servers:** High-density storage arrays where vertical space is limited. --- ### 4. Footprint Example (Generic) If you are designing a PCB for this part, the landing pattern usually follows this logic: ```c // Pseudo-code representation of PCB Pad layout Pad_Spacing = 0.5mm; // Pitch between pins Total_Pins = 67; // 75 total positions minus keyed slots Mount_Type = "SMT"; ``` ---