The **M2AS1-6341-R2/CE** is a specialized electronic component, typically classified as a **Micro-USB 2.0 Connector** or a similar interface module used in industrial and consumer electronics. These parts are engineered for surface mount or through-hole integration on Printed Circuit Boards (PCBs). --- ### 1. Key Technical Specifications Below are the typical electronic characteristics associated with this series of connectors: | Parameter | Description | | :--- | :--- | | **Interface Type** | Micro USB 2.0 (Type AB or B) | | **Current Rating** | 1.0A - 1.8A per contact | | **Voltage Rating** | 30V AC/DC | | **Contact Resistance** | 30 mΩ Max | | **Insulation Resistance** | 1000 MΩ Min | | **Dielectric Strength** | 100V AC for 1 minute | --- ### 2. Physical Construction The part number indicates a specific mechanical configuration: * **Housing Materials:** High-temperature Thermoplastic (UL 94V-0 rated) to withstand reflow soldering temperatures. * **Contacts:** Copper alloy base with selective **Gold (Au) plating** over Nickel to ensure high conductivity and prevent oxidation. * **Shell:** Stainless steel or Copper alloy with Tin plating for structural integrity and EMI/RFI shielding. * **Mounting Style:** Usually features "Solder Tabs" or "Shell Stakes" for mechanical grounding and board retention. --- ### 3. Electronic Functionality The "6341" series parts generally provide the following electronic functions: 1. **Data Transmission:** Supports High-Speed USB 2.0 protocols (up to 480 Mbps). 2. **Power Delivery:** Facilitates charging and power distribution to the host device. 3. **EMI Shielding:** The metal shell acts as a Faraday cage, reducing electromagnetic interference that could corrupt high-speed data signals. 4. **Signal Integrity:** Precision-engineered pin geometry ensures impedance matching for data lines (D+ and D-). --- ### 4. Typical Applications * **Mobile Devices:** Smartphones, tablets, and wearables. * **Industrial Modules:** Interface ports for PLCs or diagnostic tools. * **IoT Hardware:** Power and data input for sensor nodes.