The **M2AVS-16116-R2/N** is a specific technical assembly, typically identified as a **high-density cable assembly** or a **backplane interconnect component** used in server, networking, and telecommunications hardware. It is often associated with high-speed data transmission interfaces. Below is a breakdown of the electronic parts and characteristics associated with this component: ### 1. Component Overview This part is generally categorized as a **Direct Attach Copper (DAC)** or **Internal High-Speed Cable Assembly**. It is designed to link circuit boards (PCBs) or backplanes within a chassis. --- ### 2. Key Technical Specifications | Feature | Description | | :--- | :--- | | **Connector Type** | High-density mezzanine or edge-card style connectors. | | **Signal Integrity** | Designed for high-speed differential signaling (typically supporting PCIe Gen 4/5 or SAS 4.0). | | **Wiring** | Twinaxial (Twinax) shielded copper cabling. | | **Configuration** | Likely a 16-lane (x16) or high-count multi-pair configuration. | | **Impedance** | Standard 85-ohm or 100-ohm differential impedance. | --- ### 3. Electronic Design Parts & Materials The assembly consists of several critical sub-components that ensure electrical performance: #### A. The Twinaxial Cables * **Conductors:** Silver-plated or tin-plated copper wires to minimize skin effect losses. * **Dielectric:** Low-loss Fluorinated Ethylene Propylene (FEP) or Foam Polyolefin to maintain signal velocity. * **Shielding:** Aluminum/Mylar foil wrap for electromagnetic interference (EMI) protection and reduced crosstalk. #### B. Termination PCB (Paddle Card) * **Substrate:** High-frequency laminate (like Rogers or Megtron 6) to handle GHz-range frequencies. * **Gold Plating:** The contact fingers are typically plated with hard gold (ENIG or ENEPIG) to ensure durability over multiple mating cycles. #### C. Connector Housing * **Material:** High-temperature Liquid Crystal Polymer (LCP) or thermoplastic. * **EMC Gaskets:** Often includes conductive foam or metal fingers to ground the cable shield to the chassis. --- ### 4. Typical Applications * **Server Storage:** Connecting RAID controllers to SAS/SATA/NVMe backplanes. * **Data Centers:** High-bandwidth links between switch fabrics and line cards. * **Workstations:** Internal GPU or FPGA acceleration expansions. ---