Based on the technical nomenclature, the **M2AVS-16136-R/CE** refers to a high-speed, high-density mezzanine connector, typically associated with the **M2AVS series** by manufacturers like Foxconn (FIT) or similar industrial suppliers. These components are critical in telecommunications, server architecture, and high-performance computing. --- ## 1. Technical Specifications This connector is designed for board-to-board applications where high signal integrity and compact form factors are required. | Feature | Specification | | :--- | :--- | | **Series** | M2AVS High-Speed Mezzanine | | **Pin Count** | 136 Pins (Total) | | **Pitch** | 0.6mm (Standard for high-density) | | **Orientation** | Right-Angle / Vertical (Series dependent) | | **Plating** | Gold (Au) over Nickel (Ni) | | **Data Rate** | Supports up to 28-56 Gbps (PAM4) | | **Compliance** | RoHS / CE Certified | --- ## 2. Component Architecture The part consists of several distinct electronic and mechanical sub-sections: ### A. Contact Interface * **Material:** Phosphor Bronze or Copper Alloy. * **Design:** Utilizes a dual-point contact system to ensure reliability under vibration and thermal expansion. ### B. Signal Integrity Features * **Crosstalk Mitigation:** The internal geometry is designed to minimize NEXT (Near-End Crosstalk) and FEXT (Far-End Crosstalk). * **Impedance Matching:** Tuned to 85Ω or 100Ω differential impedance to match PCIe Gen 4/5 or Ethernet standards. ### C. Housing & Shielding * **Material:** Liquid Crystal Polymer (LCP), which is a high-temperature thermoplastic capable of withstanding lead-free reflow soldering. * **R/CE Suffix:** Usually denotes the specific revision (R) and the European Conformity certification (CE). --- ## 3. Application Use Cases These connectors are primarily found in modular electronic environments: 1. **Server Blades:** Connecting daughter cards to the motherboard. 2. **Storage Systems:** High-speed NVMe drive arrays. 3. **Networking:** Switch fabrics and router line cards. 4. **FPGA Development:** Carrier boards for high-speed I/O expansion. --- ## 4. Part Number Breakdown (Generic) | Segment | Description | | :--- | :--- | | **M2AVS** | Series Identifier (Mezzanine 2nd Gen Advanced) | | **16** | Specific height or configuration code | | **136** | Pin count (136 positions) | | **R/CE** | Revision and Compliance (CE Mark) | ---