The **M2AVS-A1112-R2** is a specialized high-density connector, typically part of a board-to-board or mezzanine series used in telecommunications, servers, and high-performance computing. It is often associated with manufacturers like **FCI (Amphenol ICC)** or specifically within the **MezzSelect** or **AirMax** product families. --- ### 1. Key Technical Specifications Below is a breakdown of the typical electronic and physical attributes for this component series: | Feature | Specification (Typical) | | :--- | :--- | | **Component Type** | Mezzanine Connector (Plug/Header) | | **Number of Positions** | Variable (often 100+ high-density pins) | | **Pitch** | 1.0mm or 1.27mm (Standard for M2AVS series) | | **Contact Material** | Copper Alloy with Gold Plating | | **Termination Style** | Surface Mount (SMT) or Press-Fit | | **Data Rate Support** | Up to 10-20 Gbps (High-speed differential pairs) | | **Mounting Orientation** | Vertical / Straight | --- ### 2. Functional Electronic Components The "electronic" performance of this part is defined by its ability to maintain signal integrity across high-speed channels: #### Signal Integrity Features * **Differential Pair Geometry:** Designed to minimize crosstalk between adjacent pins, making it suitable for PCIe, Ethernet, and InfiniBand protocols. * **Impedance Matching:** The internal lead frames are engineered to maintain a specific characteristic impedance (usually 85Ω or 100Ω) to prevent signal reflections. * **Low Insertion Loss:** Materials are chosen to minimize signal degradation over high-frequency transmissions. #### Power Distribution * The connector can often be partitioned to handle both **Low-Speed Signals** and **Power Pins**. * Current carrying capacity usually ranges from **0.5A to 1.0A per contact**, depending on the specific pinout configuration and thermal dissipation requirements. --- ### 3. Applications The M2AVS-A1112-R2 is generally found in the following environments: 1. **Blade Servers:** Connecting CPU boards to backplanes. 2. **Network Switches:** Linking daughtercards to the main switching fabric. 3. **Industrial Computing:** Used where high-density I/O is required in a small footprint. 4. **Medical Imaging:** High-bandwidth data transfer for real-time sensor processing. --- ### 4. Part Number Breakdown (Example Logic) While proprietary to the manufacturer, the suffix codes typically represent: * **M2AVS:** Product Series (High-speed Mezzanine). * **A1112:** Specific configuration (number of rows, columns, and stack height). * **R2:** Revision 2 or RoHS 2 compliance status.