The **M2AVS-A1316-R** is a specific part number usually associated with high-density memory modules or specialized storage interface components, often found in industrial or server-grade hardware. Based on the nomenclature, it typically refers to an **M.2 Interface Connector** or a **Small Outline Memory/Storage module** manufactured by specialized electronic component firms (like JAE or Advantech). Below is a breakdown of the electronic characteristics and specifications typical of this class of components. ### 1. Technical Specifications This component is designed to facilitate high-speed data transfer between a motherboard and a peripheral (like an SSD or communication module). | Feature | Specification | | :--- | :--- | | **Connector Type** | M.2 (Next Generation Form Factor - NGFF) | | **Keying** | Typically B-Key or M-Key (depending on application) | | **Mounting Type** | Surface Mount (SMT) / Right Angle | | **Contact Material** | Copper Alloy with Gold Plating | | **Data Rate Support** | PCIe Gen 3/4, SATA 3.0, USB 3.0 | | **Pitch** | 0.5mm | --- ### 2. Physical Construction The part is engineered for durability and signal integrity in compact spaces. * **Housing:** High-temperature thermoplastic (LCP - Liquid Crystal Polymer) to withstand reflow soldering temperatures. * **Terminations:** Solder pads designed for automated pick-and-place assembly. * **Shielding:** Integrated metal tabs for EMI (Electromagnetic Interference) reduction and mechanical grounding. --- ### 3. Key Electronic Functions * **High-Speed Signal Integrity:** The internal geometry of the pins is optimized to minimize crosstalk and insertion loss, essential for NVMe speeds. * **Power Delivery:** Capable of handling standard 3.3V rails required by M.2 devices with specific current ratings (usually 0.5A per pin). * **Thermal Management:** The "R" suffix often denotes "Reel" packaging for industrial manufacturing, but it can also signify specific height clearances to allow airflow under the mounted module. --- ### 4. Common Applications These parts are integrated into the following hardware: 1. **Industrial PCs (IPC):** Providing slots for cellular (LTE/5G) or storage expansion. 2. **Embedded Systems:** Used in IoT gateways where space is a premium. 3. **Edge Computing:** Connecting AI accelerators (like M.2 Google TPU or Intel Movidius). ---