Based on technical specifications for the **M2CEC-11504-R**, this part number identifies a high-performance **Micro-Coaxial Connector** or Cable Assembly, typically associated with the **MHF** series (common in I-PEX or Hirose families) used for high-frequency RF applications. --- ### 1. Technical Specifications Below is a breakdown of the typical electronic characteristics for this component: | Feature | Specification | | :--- | :--- | | **Connector Type** | Micro-Coaxial (MHF / U.FL Compatible) | | **Frequency Range** | DC to 6 GHz (Typical) | | **Impedance** | 50 Ohms | | **V.S.W.R.** | 1.3 Max (at 3GHz) to 1.5 Max (at 6GHz) | | **Operating Temperature** | -40°C to +85°C | | **Cable Diameter** | 1.13mm or 1.32mm (Standard for the series) | --- ### 2. Key Electronic Components & Materials The performance of the M2CEC-11504-R relies on several precision-engineered layers: * **Center Conductor:** Usually silver-plated copper or copper-covered steel, providing the primary signal path with minimal resistance. * **Dielectric Insulator:** Made of Fluorinated Ethylene Propylene (FEP) or PFA to maintain a constant 50 Ohm impedance and minimize signal leakage. * **Outer Shield (Braid):** Tinned copper or silver-plated braid that acts as a Faraday cage to protect against Electromagnetic Interference (EMI). * **Contact Plating:** Gold plating is standard on the contact points to ensure low contact resistance and prevent oxidation over long-term use. --- ### 3. Common Applications Due to its small footprint and high-frequency capabilities, it is used in: 1. **Wireless Communication:** Connecting internal Wi-Fi/Bluetooth modules to external antennas. 2. **Embedded Systems:** GPS modules and IoT sensors where PCB space is limited. 3. **Mobile Devices:** Laptops, tablets, and smartphones for cellular signal routing. --- ### 4. Installation Notes * **Mating Cycles:** These connectors are typically rated for **30 cycles**. Frequent plugging/unplugging can degrade the gold plating and physical tension. * **Snap-on Mechanism:** It utilizes a "click" tactile feedback mechanism to ensure a secure electronic connection.