M2CEC-150E-R/Q
AI

The **M2CEC-150E-R/Q** is a high-performance, industrial-grade System-on-Module (SoM) or COM Express module, typically associated with the **ADLINK Express-CFR** series (specifically the COM Express Type 6 Basic size). It is designed for compute-intensive applications requiring high reliability.
---
## Technical Specifications
| Component | Specification | Details |
| :--- | :--- | :--- |
| **Processor (CPU)** | Intel® Core™ i7-9850HE | 6 Cores, 12 Threads, 2.7 GHz (4.4 GHz Turbo) |
| **Form Factor** | COM Express Type 6 | Basic size (125 mm x 95 mm) |
| **Memory Support** | Dual Channel DDR4 | Supports ECC or non-ECC up to 2666 MHz |
| **Graphics** | Intel® UHD Graphics 630 | Supports up to 3 independent displays (DP/HDMI/VGA) |
| **PCIe Interface** | PCIe Gen3 | 1 x16 (PEG), 8 x1 (configurable) |
| **Operating Temp** | Standard or Extended | R/Q variants often denote specific thermal ratings |
---
## Core Electronic Subsystems
### 1. Power Management (VRM)
The module integrates complex Voltage Regulator Modules (VRMs) to convert the standard **+12V input** from the carrier board into the low-voltage, high-current rails required by the 9th Gen Intel processor (Vcore, VccGT, VccSA).
### 2. High-Speed I/O Connectivity
As a COM Express Type 6 module, the electronic routing is optimized for:
* **SATA Gen 3:** 4 ports for high-speed storage.
* **USB 3.1/2.0:** Support for high-bandwidth peripherals.
* **GbE Controller:** Integrated Intel® Ethernet Connection I219-LM with AMT support.
### 3. Thermal Design
The "R/Q" designation often refers to the **Ruggedization** level.
* **Passive components:** Use of industrial-grade capacitors and resistors to handle vibration.
* **Heat Spreader:** The module typically comes with an integrated heat spreader designed to interface with a larger cooling solution.
---
## Pinout Logic (Type 6)
The module connects to a carrier board via two 220-pin connectors (Rows A/B and C/D).
```c
// Conceptual pin distribution for M2CEC series
Connector_AB {
Pins_1-10: Power_GND;
Pins_11-40: Gigabit_Ethernet / USB;
Pins_41-110: PCIe_Lanes / SATA;
}
Connector_CD {
Pins_1-50: Digital_Display_Interfaces (DDI);
Pins_51-100: PEG_x16_Interface;
}
```
---
## Key Applications
* **Medical Imaging:** Processing high-resolution ultrasound or CT data.
* **Industrial Automation:** Real-time control and machine vision.
* **Military/Aerospace:** Used in ruggedized mission computers due to the high-vibration resistance of the COM Express mounting.
---
- ⤷What is the power consumption (TDP) for this specific module?
- ⤷ What carrier board is recommended for the M2CEC-150E?
- ⤷ Does this module support hardware-level encryption like TPM 2.0?