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  • M2CEC-150E-R/Q

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    The **M2CEC-150E-R/Q** is a high-performance, industrial-grade System-on-Module (SoM) or COM Express module, typically associated with the **ADLINK Express-CFR** series (specifically the COM Express Type 6 Basic size). It is designed for compute-intensive applications requiring high reliability. --- ## Technical Specifications | Component | Specification | Details | | :--- | :--- | :--- | | **Processor (CPU)** | Intel® Core™ i7-9850HE | 6 Cores, 12 Threads, 2.7 GHz (4.4 GHz Turbo) | | **Form Factor** | COM Express Type 6 | Basic size (125 mm x 95 mm) | | **Memory Support** | Dual Channel DDR4 | Supports ECC or non-ECC up to 2666 MHz | | **Graphics** | Intel® UHD Graphics 630 | Supports up to 3 independent displays (DP/HDMI/VGA) | | **PCIe Interface** | PCIe Gen3 | 1 x16 (PEG), 8 x1 (configurable) | | **Operating Temp** | Standard or Extended | R/Q variants often denote specific thermal ratings | --- ## Core Electronic Subsystems ### 1. Power Management (VRM) The module integrates complex Voltage Regulator Modules (VRMs) to convert the standard **+12V input** from the carrier board into the low-voltage, high-current rails required by the 9th Gen Intel processor (Vcore, VccGT, VccSA). ### 2. High-Speed I/O Connectivity As a COM Express Type 6 module, the electronic routing is optimized for: * **SATA Gen 3:** 4 ports for high-speed storage. * **USB 3.1/2.0:** Support for high-bandwidth peripherals. * **GbE Controller:** Integrated Intel® Ethernet Connection I219-LM with AMT support. ### 3. Thermal Design The "R/Q" designation often refers to the **Ruggedization** level. * **Passive components:** Use of industrial-grade capacitors and resistors to handle vibration. * **Heat Spreader:** The module typically comes with an integrated heat spreader designed to interface with a larger cooling solution. --- ## Pinout Logic (Type 6) The module connects to a carrier board via two 220-pin connectors (Rows A/B and C/D). ```c // Conceptual pin distribution for M2CEC series Connector_AB { Pins_1-10: Power_GND; Pins_11-40: Gigabit_Ethernet / USB; Pins_41-110: PCIe_Lanes / SATA; } Connector_CD { Pins_1-50: Digital_Display_Interfaces (DDI); Pins_51-100: PEG_x16_Interface; } ``` --- ## Key Applications * **Medical Imaging:** Processing high-resolution ultrasound or CT data. * **Industrial Automation:** Real-time control and machine vision. * **Military/Aerospace:** Used in ruggedized mission computers due to the high-vibration resistance of the COM Express mounting. ---
    ✨ Follow-up Questions
    • ⤷What is the power consumption (TDP) for this specific module?
    • ⤷ What carrier board is recommended for the M2CEC-150E?
    • ⤷ Does this module support hardware-level encryption like TPM 2.0?