The **M2CEC-21001-R** is a specific high-performance connector module, typically associated with high-speed data transmission interfaces like **M.2 (NGFF)** or specialized **Edge Card** connectors used in industrial and computing applications. Below is a breakdown of the electronic and mechanical specifications for this part. --- ### 1. General Specifications This part is engineered for high-density electronic assemblies where space and signal integrity are critical. | Feature | Specification | | :--- | :--- | | **Component Type** | M.2 (Next Generation Form Factor) Connector | | **Orientation** | Right-Angle / Horizontal | | **Pitch** | 0.50 mm | | **Number of Positions** | 67-Pin (Standard for M.2) | | **Mounting Type** | Surface Mount (SMT) | | **Keying** | Typically "M" Key or "B" Key (Check specific datasheet suffix) | --- ### 2. Key Electronic Characteristics The M2CEC series is designed to handle high-frequency signals with minimal loss. * **Contact Resistance:** Usually rated at a maximum of **55mΩ**. This ensures minimal voltage drop across the connection. * **Current Rating:** Approximately **0.5A per pin**. While low, the high pin count allows for sufficient power delivery to NVMe drives or wireless cards. * **Dielectric Withstanding Voltage:** **300V AC** for 1 minute, ensuring insulation integrity between adjacent pins. * **Signal Integrity:** Optimized for PCIe Gen 3/Gen 4, SATA 3.0, and USB 3.0/4.0 high-speed protocols. --- ### 3. Material Composition The reliability of the connector depends on its physical build: | Part | Material | Purpose | | :--- | :--- | :--- | | **Insulator** | High-Temp Thermoplastic (LCP) | Withstands reflow soldering temperatures. | | **Contact Base** | Copper Alloy | Provides excellent conductivity and flexibility. | | **Contact Plating** | Gold (Flash or 15-30u") over Nickel | Prevents corrosion and maintains signal quality. | | **Solder Tabs** | Tin-plated Copper | Enhances PCB adhesion and mechanical stability. | --- ### 4. Typical Applications The M2CEC-21001-R is commonly found in the following electronic environments: 1. **Industrial PCs:** Used for mSATA or NVMe storage expansion. 2. **Networking Hardware:** Hosting Wi-Fi 6 or 5G LTE modules. 3. **Embedded Systems:** Providing a modular interface for AI accelerators (e.g., Google Coral or Hailo modules). 4. **Consumer Laptops:** Main interface for SSD storage. --- ### 5. Footprint Diagram (Simplified) ```text [Top View of PCB Pads] _______________________ | | | | | | | | | | | | | <-- 0.5mm Pitch Pads |_______________________| | [Plastic Housing] | |_______________________| |_| |_| <-- Solder Hold-down Tabs ```