The **M2CEC-2350B-R2** is a high-performance, industrial-grade COM Express Type 6 Compact module. It is designed for embedded computing applications that require a balance between high-speed processing and power efficiency. --- ### 1. Core Processing & Architecture At its heart, this module utilizes the Intel® Core™ platform, specifically designed for industrial reliability and long-lifecycle support. | Component | Specification | | :--- | :--- | | **Processor Family** | 3rd Generation Intel® Core™ (Ivy Bridge) | | **Form Factor** | COM Express® Compact (95 x 95 mm) | | **Type** | PICMG COM.0 R2.1 Type 6 | | **Chipset** | Intel® QM77 PCH | --- ### 2. Key Electronic Interfaces The "Type 6" pinout defines how the electronic signals are routed to the carrier board. Below are the primary input/output electronic subsystems: #### Memory Subsystem * **Type:** 204-pin DDR3L SO-DIMM slots. * **Capacity:** Supports up to 16GB. * **Speed:** 1333/1600 MHz. #### High-Speed I/O (Data Transfer) * **PCI Express:** Includes PCIe x16 (Gen 3) for external graphics or high-speed FPGA cards, and 7 x1 PCIe Gen 2 lanes for peripheral expansion. * **Storage:** Integrated SATA controllers (6Gb/s and 3Gb/s) for SSD and HDD connectivity. * **USB:** Supports USB 3.0 (SuperSpeed) and USB 2.0. #### Graphics & Display * **Digital Display Interfaces (DDI):** Support for DisplayPort, HDMI, and DVI. * **Legacy Support:** Includes dual-channel 18/24-bit LVDS and VGA. --- ### 3. Power and Thermal Management The electronic design incorporates robust power regulation to ensure stability in harsh environments. 1. **Power Input:** Wide-range input (standard 12V DC) with support for AT/ATX modes. 2. **Thermal Protection:** Integrated heat spreader and temperature monitoring sensors to trigger throttling if the CPU exceeds safe operating limits. 3. **Industrial Reliability:** Built with high-grade capacitors and oscillators to withstand vibrations and thermal cycling. --- ### 4. Expansion Pinout (Type 6) The module connects to a carrier board via two high-density connectors (Rows A/B and C/D). | Signal Group | Purpose | | :--- | :--- | | **LPC Bus** | For legacy I/O like SuperIO chips. | | **SMBus / I2C** | For system management and peripheral communication. | | **GbE** | Integrated Intel® 82579LM Gigabit Ethernet controller. | | **HD Audio** | High-definition digital audio link. | ---