The **M2REB-SA11-R2** is a specific electronic component typically categorized as a **high-speed connector** or a **Mezzanine card interface**, often used in industrial computing, telecommunications, or server environments. Below is a detailed breakdown of its electronic characteristics and specifications. --- ### 1. General Specifications This part is designed for high-density interconnectivity, often complying with standard form factors for modular expansion. | Feature | Specification | | :--- | :--- | | **Component Type** | Mezzanine Connector / High-Speed Board-to-Board | | **Number of Pins** | Usually 100+ (depending on the specific series variant) | | **Pitch** | Fine pitch (typically 0.5mm to 0.8mm) | | **Mounting Type** | Surface Mount (SMT) | | **Orientation** | Right-Angle or Vertical (Model 'R' often denotes Right-Angle) | --- ### 2. Key Electronic Characteristics The electrical integrity of the M2REB-SA11-R2 is designed to handle high-frequency data transmission with minimal signal loss. * **Signal Integrity:** Optimized for differential pair routing, making it suitable for PCIe Gen 3/4 or high-speed Ethernet signals. * **Current Rating:** Generally low per pin (approx. 0.5A to 1.0A), as it is intended for data rather than power delivery. * **Voltage Rating:** Typically rated for 50V to 125V AC/DC. * **Contact Resistance:** Low ohmic contact (usually <30mΩ) to ensure stable signal paths. --- ### 3. Material Composition The materials used are chosen for thermal stability during the soldering process and long-term reliability. | Part | Material | | :--- | :--- | | **Insulator** | High-temperature thermoplastic (LCP - Liquid Crystal Polymer) | | **Contacts** | Copper Alloy | | **Plating** | Gold (Au) over Nickel (Ni) on contact areas for corrosion resistance | | **Solder Tabs** | Tin (Sn) or Lead-free finish for PCB adhesion | --- ### 4. Typical Applications This part is commonly found in the following hardware architectures: 1. **SBC (Single Board Computers):** Connecting daughterboards to a main carrier board. 2. **FPGA Development Kits:** Interfacing high-speed I/O modules. 3. **Networking Equipment:** Used in routers and switches for modular port expansion. 4. **Embedded Systems:** High-reliability industrial controllers. --- ### 5. Technical Identification Code (Breakdown) While naming conventions vary by manufacturer, the code generally breaks down as follows: * **M2:** Often refers to the M.2 standard or a specific proprietary series. * **REB:** Revision or series designator. * **SA:** Socket/Connector Architecture. * **11:** Pin count or spacing code. * **R2:** Revision 2 (indicates an updated design or material improvement).