Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • M2SBS-111-R2

  • AI
    The **M2SBS-111-R2** is a specific variant of a standard M.2 (Next Generation Form Factor) connector, typically manufactured by companies like **LOTES** or **TE Connectivity**. These components are critical interface points between a computer's motherboard and expansion cards like NVMe SSDs or Wi-Fi modules. --- ### 1. Key Technical Specifications The "M2SBS" series generally refers to the physical socket connector. Below are the typical electronic and mechanical characteristics for this part number: | Feature | Specification | | :--- | :--- | | **Connector Type** | M.2 (NGFF) Socket | | **Pitch** | 0.50 mm | | **Pin Count** | 67 Pins | | **Keying** | Typically **M-Key** (often used for PCIe x4 NVMe SSDs) | | **Mounting Type** | Surface Mount (SMT) | | **Orientation** | Right Angle / Horizontal | | **Height** | Typically 3.2mm or 4.2mm (varies by sub-version) | --- ### 2. Electronic Functionality The electronic architecture of the M2SBS-111-R2 is designed to handle high-speed differential signals. * **Signal Integrity:** The pins are gold-plated to ensure low contact resistance and to prevent oxidation over long periods. * **Power Delivery:** The pinout includes dedicated lanes for **3.3V power supply**, which is the standard voltage for M.2 peripherals. * **Data Throughput:** Designed to support high-speed protocols including **PCIe Gen 3 and Gen 4**, SATA 3.0, and USB 3.0 depending on the motherboard's routing. * **Grounding:** Features integrated grounding metal tabs (Solder pegs) that provide both mechanical stability and EMI (Electromagnetic Interference) shielding. --- ### 3. Physical Construction The "R2" suffix usually denotes a revision or a specific packaging/mounting style. * **Housing Material:** High-temperature thermoplastic (LCP - Liquid Crystal Polymer) capable of withstanding reflow soldering temperatures (up to 260°C). * **Contact Material:** Copper alloy with selective gold plating on the contact interface and tin plating on the solder tails. * **Standoff Height:** The "111" sequence in the part number often dictates the specific height of the connector body off the PCB, allowing for components to be populated underneath the M.2 card if necessary. --- ### 4. Common Applications This part is predominantly found in: 1. **Laptops/Ultrabooks:** For compact storage expansion. 2. **Desktop Motherboards:** As the primary interface for NVMe SSDs. 3. **Industrial PCs:** For mSATA or M.2 cellular/GPS modules.
    ✨ Follow-up Questions
    • ⤷ What are the specific differences between M-key and B-key M.2 connectors?
    • ⤷ How does the 'R2' revision affect the soldering process for this component?
    • ⤷ What is the maximum data transfer rate supported by the M2SBS series?