The **M2SBS-C14-R** is a specific electronic component, typically categorized as a **Board-to-Board (B2B) or Mezzanine Connector**. These are widely used in compact electronics like laptops, smartphones, and industrial embedded systems to connect two printed circuit boards (PCBs) in a stacked configuration. --- ## 1. Technical Specifications Below are the typical electronic and physical characteristics associated with this part number (based on standard M2 series mezzanine connector specifications): | Feature | Specification | | :--- | :--- | | **Connector Type** | Receptacle (Female) | | **Number of Positions** | 14 Pins | | **Pitch (Spacing)** | 0.5mm to 0.8mm (Commonly 0.5mm) | | **Mounting Type** | Surface Mount (SMD / SMT) | | **Orientation** | Straight / Vertical | | **Current Rating** | ~0.5A per contact | | **Voltage Rating** | 50V AC/DC | | **Stacking Height** | Variable (Depends on the mating plug) | --- ## 2. Key Electronic Components & Materials The functionality of the M2SBS-C14-R is defined by its material composition: * **Contacts (Pins):** Usually made of **Phosphor Bronze** or **Copper Alloy**. These are gold-plated (or gold flash) to ensure high conductivity and prevent oxidation over time. * **Insulator Housing:** Made of **High-Temperature Thermoplastic** (like LCP - Liquid Crystal Polymer). This allows the part to withstand the high heat of lead-free reflow soldering processes. * **Shielding/Reinforcement:** Often includes metallic "solder tabs" on the sides to provide mechanical strain relief, ensuring the connector doesn't snap off the board during vibration. --- ## 3. Pinout and Signal Integrity The 14-pin configuration is designed for low-power signal transmission. In a typical application: 1. **Data Lines:** High-speed signals (like MIPI for cameras or low-speed I2C/SPI). 2. **Power/Ground:** Multiple pins are often assigned to Ground (GND) to reduce electromagnetic interference (EMI) and provide a stable return path for signals. --- ## 4. Common Applications This part is generally found in: * **Mobile Devices:** Connecting a secondary sensor board to the main logic board. * **Wearables:** Connecting battery management systems to the display. * **Industrial Modules:** Small-form-factor IoT sensors. ---