The **M2SES2-6C-R2** is a specific part number typically associated with high-density, high-performance connectors, often used in aerospace, defense, or high-reliability industrial computing applications. These components are frequently found in systems utilizing the **VPX (VITA 46/48)** or **OpenVPX** standards. Below is a detailed breakdown of its electronic and mechanical characteristics. --- ### 1. General Specifications The part belongs to a family of ruggedized, multi-contact connectors designed for backplane or mezzanine environments. | Feature | Specification | | :--- | :--- | | **Component Type** | Mezzanine Connector / High-Speed Stacking Connector | | **Contact Density** | High (Multi-row configuration) | | **Signal Integrity** | Optimized for Differential Pairs (High-speed data) | | **Mounting Style** | Surface Mount (SMT) or Press-fit (Depends on specific sub-series) | | **Orientation** | Vertical / Right Angle (Application dependent) | ### 2. Electronic Characteristics These parts are engineered to handle sensitive electronic signals while maintaining low noise and high throughput. * **Impedance Control:** Designed for 85-ohm or 100-ohm differential impedance to support protocols like PCIe Gen 3/4, 10GbE, and SATA. * **Contact Resistance:** Typically very low (milli-ohm range) to prevent signal degradation and heat buildup. * **Current Rating:** Usually rated for small signal currents (approx. 0.5A to 1.0A per contact), though power pins may be rated higher. * **Dielectric Withstanding Voltage:** Designed to resist arcing and breakdown at standard operating voltages (often 500V AC or higher). ### 3. Physical & Material Composition The "R2" suffix often denotes a revision or a specific RoHS compliance status. * **Housing Material:** High-temperature Liquid Crystal Polymer (LCP) or equivalent thermoplastic, capable of withstanding reflow soldering temperatures. * **Plating:** Contact areas are typically plated with **Gold (Au)** over Nickel (Ni) to prevent oxidation and ensure reliable connectivity over hundreds of mating cycles. * **Alignment Features:** Includes guide pins or polarized housings to prevent "blind-mate" misalignment, which could damage the electronic pins. ### 4. Typical Applications The M2SES2 series is commonly integrated into the following systems: 1. **Single Board Computers (SBCs):** Connecting the processor board to a peripheral carrier. 2. **FPGA Mezzanine Cards (FMC):** Providing high-bandwidth paths for data acquisition. 3. **Avionics Systems:** Where vibration resistance and compact form factors are mandatory. 4. **Radar/Signal Processing:** Handling massive amounts of raw sensor data across board interfaces. ---