The **M3E58XQD-R** is a high-performance, industrial-grade memory module part number, typically associated with **DDR4 SDRAM** (Synchronous Dynamic Random-Access Memory). Specifically, it is manufactured by **Micron** (or one of its specialized partners) and is designed for use in enterprise servers, high-end workstations, and networking equipment. Below is a detailed breakdown of the electronic specifications and characteristics. ### 1. Technical Specifications The table below summarizes the core technical parameters of this specific part: | Parameter | Specification | | :--- | :--- | | **Technology** | DDR4 SDRAM | | **Capacity** | 32GB (Standard for this series) | | **Speed Rating** | PC4-2666V or PC4-3200 (Varies by sub-revision) | | **Form Factor** | RDIMM (Registered Dual In-Line Memory Module) | | **Voltage** | 1.2V | | **Rank** | 2Rx4 (Dual Rank, x4 Data Width) | | **Error Correction** | ECC (Error-Correcting Code) | --- ### 2. Key Electronic Components The module is composed of several critical electronic sub-parts: * **DRAM ICs (Integrated Circuits):** These are the individual memory chips soldered onto the PCB. In a 2Rx4 configuration, these chips are organized into two "ranks" to allow for higher density and parallel data access. * **RCD (Registering Clock Driver):** As an **RDIMM**, this module features an RCD chip. This component buffers the command and address signals from the memory controller, reducing the electrical load on the system and allowing for greater stability when using multiple modules. * **SPD EEPROM (Serial Presence Detect):** A small non-volatile memory chip that stores the module's timing, voltage, and manufacturer information. The BIOS/UEFI reads this to configure the system correctly. * **Temperature Sensor:** Integrated within the SPD or as a standalone component, it monitors thermal levels to trigger "throttling" if the module exceeds safe operating temperatures. --- ### 3. Key Electronic Features #### ECC (Error-Correcting Code) The "E" in the series designation usually refers to the ECC capability. This allows the memory to detect and fix single-bit data corruption and detect multi-bit errors, which is essential for preventing system crashes in 24/7 server environments. #### Power Efficiency Operating at **1.2V**, this part represents a significant power reduction compared to older DDR3 (1.5V) or DDR3L (1.35V) modules. This reduces the thermal footprint within dense server racks. --- ### 4. Implementation Context To use this part, the system motherboard must support: 1. **DDR4 Architecture** (DDR3 or DDR5 slots are physically incompatible). 2. **Registered (Buffered) Memory** (Consumer motherboards usually only support Unbuffered/UDIMM).