MDW2A-4R-R
AI

The **MDW2A-4R-R** is a high-performance power inductor part of the MDW series, typically manufactured by companies like **Mag.Layers**. These components are designed for high-density power applications such as DC-DC converters.
### Technical Specifications
Below are the primary technical parameters for the MDW2A-4R-R:
| Parameter | Specification |
| :--- | :--- |
| **Inductance** | 4.7 µH |
| **Tolerance** | ±20% (indicated by 'M' or standard series tolerance) |
| **DC Resistance (DCR)** | ~145 mΩ (Max) |
| **Saturation Current (Isat)** | ~1.30 A |
| **Heat Rating Current (Irms)** | ~1.15 A |
| **Package Size** | 2520 (2.5mm x 2.0mm) |
| **Height** | 1.0 mm (Max) |
| **Material** | Metal Alloy (Shielded) |
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### Key Features
* **Metal Alloy Construction:** Uses a molded metal powder core which provides high saturation currents and low acoustic noise compared to traditional ferrite cores.
* **Magnetic Shielding:** The molded structure inherently provides magnetic shielding, reducing Electromagnetic Interference (EMI) with surrounding components.
* **Low Profile:** With a 1.0mm height, it is ideal for ultra-thin electronics like smartphones and wearables.
* **High Efficiency:** Optimized for low DCR to minimize power loss and heat generation during operation.
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### Part Number Breakdown
The nomenclature typically follows this logic:
1. **MDW**: Series Name (Metal Alloy Molded Power Inductor).
2. **2A**: Size Code (roughly 2.5 x 2.0 mm).
3. **4R7**: Inductance Value ($4.7$ microhenries).
4. **R**: Packing/Revision code (usually denotes Tape & Reel).
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### Common Applications
The MDW2A-4R-R is frequently found in:
* **Mobile Devices:** Smartphones, tablets, and handheld gaming consoles.
* **Portable Computing:** SSDs, laptops, and ultra-books.
* **Power Management:** Small DC-DC converter modules and Point-of-Load (POL) regulators.
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- ⤷
What are the main differences between metal alloy and ferrite core inductors?
- ⤷ How does the saturation current affect the performance of this inductor in a circuit?
- ⤷ Is there a recommended soldering footprint for the 2520 package size?