The **MLC10-R82M-RC** is a high-performance, surface-mount (SMD) power inductor commonly used in DC-DC converter applications. Below is a detailed technical breakdown of its electronic specifications and characteristics. ### 1. General Specifications The part number follows a specific nomenclature that defines its physical and electrical properties: | Parameter | Specification | | :--- | :--- | | **Inductance** | 0.82 µH | | **Tolerance** | ±20% (indicated by 'M') | | **Series** | MLC10 (High Current Power Inductor) | | **Mounting Type** | SMD (Surface Mount Device) | | **RoHS Status** | Compliant (indicated by 'RC') | --- ### 2. Electrical Characteristics These parts are designed for high-efficiency power management. * **Saturation Current ($I_{sat}$):** This is the current at which the inductance drops by a specified percentage (usually 20-30%). For this series, it is typically very high, allowing for stable performance during current spikes. * **Heating Current ($I_{rms}$):** The continuous DC current that causes a specific temperature rise (usually 40°C) above ambient. * **DCR (DC Resistance):** Extremely low resistance to minimize power loss and heat generation. * **Operating Temperature:** Generally rated from -40°C to +125°C. --- ### 3. Construction and Materials The "MLC" series usually utilizes a **molded metal powder core**. This construction offers several advantages over traditional ferrite drum cores: 1. **Shielded Design:** The molded construction provides inherent magnetic shielding, reducing Electromagnetic Interference (EMI) with neighboring components. 2. **Soft Saturation:** Unlike ferrite cores that lose inductance abruptly, metal powder cores have a "soft" saturation curve, making the circuit more stable under heavy loads. 3. **High Power Density:** Large current handling capability within a relatively small footprint. --- ### 4. Common Applications Due to its low inductance and high current rating, the MLC10-R82M-RC is typically found in: * **Voltage Regulator Modules (VRMs):** Powering CPUs and GPUs. * **DC-DC Converters:** Buck, Boost, and SEPIC topologies. * **Industrial Electronics:** High-current power supplies and battery-powered devices. * **Automotive:** Infotainment and LED lighting drivers. --- ### 5. Land Pattern / Footprint Example *Note: Dimensions are usually in mm. Always refer to the manufacturer's datasheet for precise PCB layout.* ```text [ 10.0mm ] +------------+ | | 10.0mm| 0.82uH | | | +------------+ ``` ---