The **MLZ2012DR47DTD25** is a high-performance multilayer inductor manufactured by **TDK Corporation**. It belongs to the MLZ series, which is specifically designed for decoupling circuits in power supply lines. --- ### 1. Technical Specifications The following table outlines the primary electrical and physical characteristics of this component: | Parameter | Value / Specification | | :--- | :--- | | **Inductance** | 0.47 µH | | **Tolerance** | ±20% | | **DC Resistance (Max)** | 0.11 Ω (110 mΩ) | | **Rated Current (Isat)** | 800 mA | | **Test Frequency** | 2 MHz | | **Operating Temperature** | -55°C to +125°C | | **Package Size (EIA)** | 0805 (Metric: 2012) | | **Dimensions** | 2.00mm x 1.25mm x 1.25mm | --- ### 2. Part Number Breakdown The nomenclature of the part number reveals its specific configuration: - **MLZ**: Series name (Multilayer Inductor for Power Line). - **2012**: Dimensions (2.0mm length x 1.25mm width). - **D**: Characteristic type (Indicates high current/low resistance profile). - **R47**: Inductance value (R47 = 0.47 µH). - **D**: Tolerance (D generally refers to the specific material/design tier in this series). - **T**: Packaging style (Taping/Reel). - **D25**: Internal control code for specific thickness or performance refinements. --- ### 3. Key Features and Advantages * **Multilayer Structure:** Unlike wire-wound inductors, this uses a multilayer process that allows for a compact, shielded design with no external wires. * **Low DC Resistance:** The "D" type characteristic ensures low RDC, which minimizes power loss and heat generation during operation. * **Magnetic Shielding:** The multilayer construction provides internal magnetic shielding, reducing Electromagnetic Interference (EMI) with surrounding components. * **Current Handling:** Designed specifically to handle the ripple current requirements of DC-DC converters and power management ICs (PMICs). --- ### 4. Typical Applications This component is commonly found in space-constrained electronic devices where power efficiency is critical: 1. **Smartphones and Tablets:** Decoupling power lines for application processors. 2. **Wearable Tech:** Power supply filtering for IoT devices. 3. **SSD Drives:** Managing power stability for high-speed memory modules. 4. **Modules:** Compact DC-DC converter modules.