The **MPV380R8PJ-R** is a high-performance, shielded power inductor typically manufactured by brands like **ITG Electronics**. It is designed for high-frequency DC-DC converters, Voltage Regulator Modules (VRM), and point-of-load (POL) applications. --- ### ## Technical Specifications Below is a breakdown of the key electronic characteristics of the MPV380R8PJ-R: | Parameter | Value/Description | | :--- | :--- | | **Inductance** | 0.80 µH (nominal) | | **Tolerance** | ±20% | | **Saturation Current ($I_{sat}$)** | High (typically ~30A to 40A range depending on temp) | | **DC Resistance (DCR)** | Ultra-low (measured in mΩ) | | **Core Material** | Composite Powder / Iron Core | | **Shielding** | Magnetically Shielded | | **Mounting Type** | Surface Mount (SMD/SMT) | --- ### ### Key Electronic Components & Design #### 1. Composite Powder Core The "P" in the part number often signifies a **Pressed Powder** core. Unlike traditional ferrite cores, these are made from insulated metal particles. * **Benefit:** Provides a "soft" saturation curve, meaning the inductance drops gradually rather than abruptly as current increases. #### 2. Flat Wire Technology The internal winding often uses flat copper wire instead of round wire. * **Benefit:** Maximizes the cross-sectional area and reduces the "Skin Effect" at high frequencies, which keeps DCR extremely low and prevents overheating. #### 3. Magnetic Shielding The inductor is fully encapsulated in a magnetic resin or metal housing. * **Benefit:** Minimizes Electro-Magnetic Interference (EMI) with neighboring components on the PCB, which is critical for dense power stages. --- ### ### Common Applications Due to its low DCR and high current handling, it is frequently found in: * **Server CPU/GPU Power:** Multiphase buck converters for high-end processors. * **Graphics Cards:** Powering high-wattage memory and logic rails. * **Network Switches:** High-density power modules. --- ### ### Footprint and Physical Dimensions The **380** in the series code usually refers to the physical size (e.g., approximately 10mm x 7mm or similar industrial standard footprint). It features robust solder pads designed to handle high thermal stress during the reflow process.