The **PCIMX6DP6CVT2AB** belongs to the **i.MX 6DualPlus** family of applications processors developed by NXP (formerly Freescale). This specific part is designed for high-performance automotive and industrial applications, offering enhanced graphics and memory bandwidth compared to the standard i.MX 6Dual series. --- ### 1. Key Technical Specifications The architecture is based on the ARM Cortex-A9 core. Below are the primary technical parameters for this specific MPN (Manufacturer Part Number): | Parameter | Specification | |:---|:---| | **Core Architecture** | ARM Cortex-A9 (Dual Core) | | **Speed** | Up to 800 MHz / 1.0 GHz (Dependent on power mode) | | **GPU** | Vivante GC2000 (3D), GC355 (2D), GC320 (Composition) | | **Memory Support** | LPDDR2, DDR3, DDR3L (Up to 1066 MT/s) | | **Package** | 624-pin FCBGA (21mm x 21mm) | | **Temperature Range** | Industrial/Automotive (-40°C to +105°C) | | **Video Processing** | 1080p60 H.264 decode, 1080p30 H.264 encode | --- ### 2. Major Internal Components The "Plus" designation in this part signifies specific hardware improvements over the base i.MX 6 series: #### A. Processing Unit * **Dual Cortex-A9 Cores:** Features individual L1 caches and a shared 1MB L2 cache. * **NEON MPE:** Media Processing Engine for hardware-accelerated signal processing and video. #### B. Enhanced Graphics and Imaging * **Triple Graphics Engines:** Includes dedicated hardware for 3D rendering, 2D vector graphics, and image composition. * **IPU (Image Processing Unit):** Manages camera interfaces (MIPI CSI-2) and display outputs (HDMI, LVDS, Parallel). #### C. Connectivity and Interfaces * **PCIe v2.0:** One lane for high-speed peripheral expansion. * **SATA II:** Integrated 3Gbps SATA interface for HDD/SSD support. * **FlexCAN:** Controller Area Network interfaces (crucial for automotive applications). * **Gigabit Ethernet:** Support for 10/100/1000 Mbps with AVB (Audio Video Bridging). --- ### 3. Part Number Decoder (Breakdown) Understanding the nomenclature helps identify the exact capabilities of the silicon: | Segment | Code | Meaning | |:---|:---|:---| | **Brand** | **PC** | Prototype/Pre-qualification (Note: "MC" is standard production) | | **Family** | **IMX6** | i.MX 6 Series | | **Sub-family** | **DP** | DualPlus (Dual Core, Enhanced Features) | | **Temp Grade** | **6** | Industrial Grade (-40 to +105 °C) | | **Package** | **CVT** | FCBGA 21x21mm, 0.8mm pitch | | **Revision** | **2AB** | Silicon Revision 2.1 | --- ### 4. Application Use Cases Due to its robust thermal rating and enhanced memory bandwidth, this part is commonly found in: 1. **Automotive Infotainment:** Driving dual independent displays and handling rear-view camera processing. 2. **Industrial HMI:** High-resolution touch-screen interfaces in factory environments. 3. **Digital Signage:** Capable of 24/7 operation with high-definition video playback.