AI

The **QBHP684U-RV** is a high-power, surface-mount (SMD) Light Emitting Diode (LED) manufactured by **QT-Brightek**. It belongs to their high-power UV (Ultraviolet) series, specifically designed for industrial and medical applications.
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### ## Technical Specifications
Below are the primary electronic and optical characteristics typically found in the QBHP684U-RV datasheet:
| Parameter | Specification |
| :--- | :--- |
| **Package Type** | 3535 (3.5mm x 3.5mm) |
| **Wavelength (Peak)** | 390nm - 400nm (UVA range) |
| **Forward Current ($I_F$)** | 350mA - 700mA (Max) |
| **Forward Voltage ($V_F$)** | 3.0V - 4.0V (Typical 3.4V) |
| **Radiant Flux** | 450mW - 700mW @ 350mA |
| **Viewing Angle** | 120 Degrees |
| **Thermal Resistance** | ~10 °C/W |
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### ## Key Components and Design Features
1. **Ceramic Substrate:**
The device is built on a high-thermal-conductivity ceramic substrate. This is critical for UV LEDs because they generate significant heat; the ceramic helps dissipate that heat to the PCB (Printed Circuit Board) to prevent "thermal runaway" or degradation.
2. **Silicone Lens:**
It features a clear silicone molding. Unlike standard plastic, high-quality silicone is resistant to the degrading effects of UV radiation, ensuring a longer lifespan for the optical output.
3. **Gold Plating:**
The contact pads are usually gold-plated to ensure excellent solderability and to prevent oxidation, which is vital for high-current high-power components.
4. **Zener Diode Protection:**
Most parts in this series include an integrated Zener diode connected in parallel with the LED chip to provide **Electrostatic Discharge (ESD)** protection (often up to 8KV).
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### ## Circuit Design Considerations
When integrating the QBHP684U-RV into an electronic circuit, the following must be addressed:
* **Current Regulation:** Since LEDs are current-driven devices, you should use a constant current LED driver rather than a simple voltage source to ensure stable brightness and prevent burnout.
* **Heat Sinking:** At 700mA, the LED generates substantial heat. It must be mounted on a Metal Core PCB (MCPCB) or a standard PCB with a large copper pour and thermal vias.
* **Polarity:** As an SMD component, the "Anode" and "Cathode" must be correctly identified via the polarity mark on the package to avoid reverse bias damage.
```cpp
// Example: Conceptual PWM dimming for an LED Driver
int ledPin = 9; // Connected to PWM pin of LED Driver
void setup() {
pinMode(ledPin, OUTPUT);
}
void loop() {
analogWrite(ledPin, 128); // 50% Duty Cycle for 50% Power
}
```
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- ⤷
What are the safety precautions for working with 395nm UV LEDs?
- ⤷ How does the radiant flux change if I increase the forward current to 700mA?
- ⤷ What is the recommended footprint for soldering a 3535 SMD package?