SRP2010DPA-R56M
AI

## Technical Overview: SRP2010DPA-R56M
The **SRP2010DPA-R56M** is a high-current, shielded power inductor manufactured by **Bourns**. It is designed specifically for high-density power applications, utilizing a metal alloy powder core to handle high saturation currents in a compact surface-mount package.
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### 1. Key Technical Specifications
| Parameter | Value | Notes |
| :--- | :--- | :--- |
| **Inductance** | 0.56 µH | Tolerance: ±20% (indicated by 'M') |
| **Current Rating (Irms)** | 11.0 A | Temperature rise current |
| **Saturation Current (Isat)** | 22.0 A | Current at which inductance drops 30% |
| **DC Resistance (DCR)** | 7.3 mΩ (Max) | Efficiency factor |
| **Operating Temperature** | -40°C to +125°C | Includes self-heating |
| **Footprint / Size** | 2010 | 2.5 mm x 2.0 mm (approx.) |
| **Height** | 1.0 mm (Max) | Low-profile design |
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### 2. Component Composition and Design
The "DPA" series features specific construction characteristics that differentiate it from standard inductors:
* **Shielded Construction:** The inductor is magnetically shielded, which minimizes electromagnetic interference (EMI) with neighboring components—crucial for high-density PCBs.
* **Metal Alloy Powder Core:** Unlike traditional ferrite cores, the metal powder core provides a "soft saturation" characteristic. This means the inductance drops gradually rather than abruptly as current increases.
* **Flat Wire Technology:** Often used in this series to reduce DC resistance (DCR) and increase the effective cross-sectional area for current flow, reducing heat generation.
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### 3. Application Use Cases
This specific part is ideal for DC/DC converters in space-constrained environments:
1. **Smartphones and Tablets:** Due to the ultra-low 1.0 mm profile.
2. **SSD Storage:** High-current power rails for controllers and NAND flash.
3. **Distributed Power Systems:** Used in PoL (Point of Load) converters where high efficiency and small footprint are required.
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### 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **SRP** | High current shielded power inductor series |
| **2010** | Dimensions: 2.5 mm x 2.0 mm |
| **DPA** | Core material/design identifier |
| **R56** | Inductance value (R56 = 0.56 µH) |
| **M** | Tolerance (M = ±20%) |
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What are the main differences between the DPA and the standard SRP series?
- ⤷ How does 'soft saturation' improve the stability of a power supply circuit?
- ⤷ What are the recommended soldering profiles for this specific SMD package?