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  • SRP2010DPA-R56M

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    ## Technical Overview: SRP2010DPA-R56M The **SRP2010DPA-R56M** is a high-current, shielded power inductor manufactured by **Bourns**. It is designed specifically for high-density power applications, utilizing a metal alloy powder core to handle high saturation currents in a compact surface-mount package. --- ### 1. Key Technical Specifications | Parameter | Value | Notes | | :--- | :--- | :--- | | **Inductance** | 0.56 µH | Tolerance: ±20% (indicated by 'M') | | **Current Rating (Irms)** | 11.0 A | Temperature rise current | | **Saturation Current (Isat)** | 22.0 A | Current at which inductance drops 30% | | **DC Resistance (DCR)** | 7.3 mΩ (Max) | Efficiency factor | | **Operating Temperature** | -40°C to +125°C | Includes self-heating | | **Footprint / Size** | 2010 | 2.5 mm x 2.0 mm (approx.) | | **Height** | 1.0 mm (Max) | Low-profile design | --- ### 2. Component Composition and Design The "DPA" series features specific construction characteristics that differentiate it from standard inductors: * **Shielded Construction:** The inductor is magnetically shielded, which minimizes electromagnetic interference (EMI) with neighboring components—crucial for high-density PCBs. * **Metal Alloy Powder Core:** Unlike traditional ferrite cores, the metal powder core provides a "soft saturation" characteristic. This means the inductance drops gradually rather than abruptly as current increases. * **Flat Wire Technology:** Often used in this series to reduce DC resistance (DCR) and increase the effective cross-sectional area for current flow, reducing heat generation. --- ### 3. Application Use Cases This specific part is ideal for DC/DC converters in space-constrained environments: 1. **Smartphones and Tablets:** Due to the ultra-low 1.0 mm profile. 2. **SSD Storage:** High-current power rails for controllers and NAND flash. 3. **Distributed Power Systems:** Used in PoL (Point of Load) converters where high efficiency and small footprint are required. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **SRP** | High current shielded power inductor series | | **2010** | Dimensions: 2.5 mm x 2.0 mm | | **DPA** | Core material/design identifier | | **R56** | Inductance value (R56 = 0.56 µH) | | **M** | Tolerance (M = ±20%) |
    ✨ Follow-up Questions
    • ⤷ What are the main differences between the DPA and the standard SRP series?
    • ⤷ How does 'soft saturation' improve the stability of a power supply circuit?
    • ⤷ What are the recommended soldering profiles for this specific SMD package?