The **TMPF0502A-R82MN-D** is a high-current, low-profile power inductor typically used in DC-DC converter applications. It belongs to the automotive-grade or high-reliability molded power inductor family. --- ### 1. Technical Specifications The following table outlines the primary electrical and physical characteristics of this component: | Parameter | Value / Specification | | :--- | :--- | | **Inductance** | 0.82 µH | | **Tolerance** | ±20% (M) | | **DC Resistance (DCR)** | ~12.5 mΩ (Max) | | **Saturation Current (Isat)** | ~11.5 A (Typical) | | **Heat Rating Current (Irms)** | ~8.5 A (Typical) | | **Case Size** | 0502 (Approx. 5.0 x 5.0 x 2.0 mm) | | **Operating Temperature** | -55°C to +125°C | --- ### 2. Part Number Breakdown Understanding the nomenclature helps in identifying the specific variant: * **TMPF**: Series code (Taisol/Cyntec Metal Power Inductor family). * **0502**: Physical dimensions (Length/Width approx. 5.4mm, Height 2.0mm). * **A**: Internal design/material revision code. * **R82**: Inductance value (R82 = 0.82 µH). * **M**: Tolerance (M = ±20%). * **N**: Packaging/Material designation. * **D**: Suffix often indicating AEC-Q200 qualification (Automotive grade). --- ### 3. Key Features & Applications #### Features * **Molded Construction:** The coil is encapsulated in a metallic iron powder core, which provides excellent magnetic shielding and reduces EMI (Electromagnetic Interference). * **Soft Saturation:** Unlike ferrite inductors, these molded types do not have a sharp drop in inductance when current exceeds the limit; they saturate gracefully. * **High Efficiency:** Low DCR ensures minimal power loss through heat, making it ideal for battery-operated devices. #### Common Applications 1. **Voltage Regulator Modules (VRM):** Used in CPU/GPU power delivery. 2. **Automotive Electronics:** Infotainment systems, ADAS sensors, and ECU power supplies. 3. **Telecom & Industrial:** High-density DC-DC converters and distributed power systems. --- ### 4. Footprint and Mounting This is an **SMD (Surface Mount Device)** component. It features a bottom-terminal design to maximize PCB contact area, which helps in thermal dissipation. ```text Physical Outline (Top View): _________________ | | | (0.82) | <-- Part Marking | R82 | |_________________| 5.4 mm ``` ---