The **TMPIC05030F-R47** is a high-performance, shielded power inductor typically used in DC-DC converter applications. It belongs to the family of metal composite molded inductors, known for their high current handling and low acoustic noise. --- ## 1. Component Identification | Parameter | Specification | | :--- | :--- | | **Series** | TMPIC (Metal Composite) | | **Inductance** | 0.47 µH (R47) | | **Dimensions (L x W x H)** | 5.4mm x 5.2mm x 3.0mm | | **Tolerance** | ±20% | | **Core Material** | Metal Alloy Powder | --- ## 2. Key Electrical Characteristics These parts are designed for high-frequency power supplies where efficiency and space are critical. * **Saturation Current ($I_{sat}$):** This is the current at which the inductance drops by a specific percentage (usually 30%). For this series, $I_{sat}$ is relatively high, allowing it to handle power spikes without losing its inductive properties. * **Heating Current ($I_{rms}$):** The continuous current that causes a 40°C temperature rise. Metal composite inductors have low DC resistance (DCR), which minimizes heat generation. * **Operating Temperature:** Generally rated from -40°C to +125°C (including self-heating). * **Shielding:** The molded construction provides "magnetic shielding," which reduces Electromagnetic Interference (EMI) that could affect nearby sensitive circuits. --- ## 3. Physical Construction The "F" in the part number often indicates a specific lead-frame or manufacturing process style. * **Molded Structure:** The coil is placed inside a mold and pressed with metal powder. This creates a solid block that is physically robust. * **Low Acoustic Noise:** Unlike traditional ferrite core inductors, the composite structure reduces "buzzing" or "whining" sounds caused by magnetostriction. --- ## 4. Typical Applications The **0.47 µH** value is commonly found in: 1. **Buck Converters:** Stepping down voltage for CPUs, GPUs, and FPGAs. 2. **Mobile Devices:** Used in smartphones and tablets due to the low profile (3.0mm height). 3. **Automotive Infotainment:** Providing stable power to screens and sensors. 4. **SSD Power Rails:** Managing high-speed data power requirements. ---