The **VLS252010HBX-R24M-1** is a high-performance, surface-mount (SMD) power inductor manufactured by **TDK Corporation**. It is part of the VLS-HBX series, specifically designed for power circuits in compact electronic devices. --- ### 1. Key Technical Specifications The following table outlines the primary electrical and physical characteristics of the component: | Feature | Specification | | :--- | :--- | | **Inductance** | 0.24 µH | | **Tolerance** | ±20% | | **DC Resistance (Max)** | 23 mΩ (0.023 Ω) | | **Rated Current (Isat)** | 7.35 A (Saturation based) | | **Rated Current (Itemp)** | 4.85 A (Temperature rise based) | | **Size Code** | 2520 (2.5mm x 2.0mm) | | **Height (Max)** | 1.0 mm | | **Core Material** | Metal Core (Metallic Magnetic Material) | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the component's construction: * **VLS**: Product Series (Wound Ferrite/Metal Inductors). * **252010**: Dimensions (Length 2.5mm x Width 2.0mm x Height 1.0mm). * **HBX**: Internal characteristic code (High current, metal core). * **R24**: Inductance value ($0.24 \mu H$). * **M**: Tolerance ($\pm 20\%$). * **-1**: Packaging or internal revision code. --- ### 3. Core Features and Technology #### Metal Magnetic Core Unlike traditional ferrite inductors, the "HBX" series uses a metallic magnetic material. This allows for: * **Higher Current Handling:** Metal cores saturate more slowly than ferrite cores, preventing sudden drops in inductance during current spikes. * **Compact Footprint:** High energy density allows for a very low profile (1mm height), ideal for thin smartphones and tablets. #### Shielded Construction The inductor is magnetically shielded, which minimizes electromagnetic interference (EMI) with neighboring components on a high-density PCB. --- ### 4. Common Applications Due to its high current rating and small size, this inductor is typically found in: 1. **DC-DC Converters:** Used in the voltage regulator modules (VRM) of smartphones and wearable tech. 2. **Power Management Integrated Circuits (PMICs):** For high-efficiency power distribution. 3. **Portable Electronics:** SSDs, digital cameras, and IoT modules where PCB space is limited. ---