The **W2PA-11B-R/N** is a specific type of **RF (Radio Frequency) connector**, commonly classified under the **U.FL (or IPEX/MHF)** compatible family. These components are critical for establishing miniature coaxial connections in high-frequency wireless devices. ### 1. General Specifications The W2PA-11B-R/N is designed for space-constrained PCB applications where a secure connection to an external antenna or a secondary RF module is required. | Feature | Specification | | :--- | :--- | | **Component Type** | SMT (Surface Mount Technology) Receptacle | | **Frequency Range** | DC to 6 GHz | | **Impedance** | 50 Ohms (Standard) | | **Mounting Style** | PCB Right Angle (Top Entry) | | **Durability** | ~30 Mating Cycles | | **Operating Temperature** | -40°C to +85°C | --- ### 2. Key Electronic Characteristics These parts are engineered to minimize signal loss and interference at high frequencies. * **Low VSWR (Voltage Standing Wave Ratio):** Typically rated at 1.3 Max (up to 3 GHz) or 1.5 Max (up to 6 GHz). This ensures maximum power transfer from the PCB to the antenna. * **Contact Resistance:** High-quality plating (usually Gold) is used on the center contact to maintain low resistance (approx. 20m $\Omega$ max). * **Insulation Resistance:** Usually rated at 500M $\Omega$ minimum to prevent signal leakage between the signal pin and the ground shell. * **Dielectric Withstanding Voltage:** Capable of handling approx. 200V AC for one minute. --- ### 3. Physical Construction The "R/N" suffix often denotes specific packaging or orientation details (such as Reel/Natural). * **Housing:** High-temperature plastic (LCP - Liquid Crystal Polymer) to withstand reflow soldering temperatures. * **Contact:** Copper Alloy with Gold plating. * **Shell:** Phosphor Bronze with Silver or Gold plating for excellent solderability and grounding. * **Mated Height:** This series is known for its ultra-low profile, typically ranging between **1.2mm to 2.5mm** when mated with a cable plug. --- ### 4. Common Applications Due to its small footprint and high-frequency capabilities, it is found in: * **Wi-Fi / Bluetooth Modules:** Connecting internal antennas in laptops and tablets. * **IoT Devices:** LoRa, Sigfox, and Zigbee communication nodes. * **GPS Receivers:** Providing a port for external active or passive antennas. * **Smartphones:** Managing internal RF routing between boards. --- ### 5. Soldering Footprint (Typical) When designing a PCB for this part, the landing pattern usually follows a three-pad layout: 1. **Center Pad:** Signal (Hot). 2. **Two Side Pads:** Ground (Shielding and mechanical stability). ```text [ Ground ] [ Signal ] [ Ground ] |-----------| | |-----------| ```