Description

The IRF6619 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.

• Low Profile (<0.7 mm)

• Dual Sided Cooling Compatible

• Ultra Low Package Inductance

• Optimized for High Frequency Switching above 1MHz

• Ideal for CPU Core DC-DC Converters

• Optimized for Sync. FET socket of Sync. Buck Converter

• Low Conduction Losses

• Compatible with existing Surface Mount Techniques