| Manufacturer | Part # | Datasheet | Description |
 National Semiconductor ... |
MTD48
|
62Kb / 1P |
48 Lead Molded Thin Shrink Small Outline Package, JEDEC
|
 STMicroelectronics |
TSSO20
|
57Kb / 4P |
20-LEAD THIN SHRINK SMALL OUTLINE
Nov-2002 |
 NXP Semiconductors |
SOT765-1
|
13Kb / 1P |
plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
2002 Jun 07 |
 fujitsu semiconductor |
FPT-20P-M04
|
37Kb / 1P |
THIN SHRINK SMALL OUTLINE PACKAGE
|
 Amkor Technology |
CSSOP
|
304Kb / 1P |
Ceramic Shrink Small Outline Package
|
 STMicroelectronics |
TSSOP14
|
58Kb / 4P |
14-LEAD THIN SHRINK SMALL OUTLINE
Nov-2002 |
 ACCUTEK MICROCIRCUIT CO... |
AKB083220
|
159Kb / 2P |
Thin Small Outline Packages TSOP to SOIC BGA Adapters
|
|
AKL083220
|
128Kb / 2P |
Thin Shrink Small Outline Packages TSOP to SOIC Leaded Adapters
|
 Amkor Technology |
SSOP
|
433Kb / 2P |
Shrink Small Outline, Quarter-Size Small-Outline Packages
|
 Guangdong Youtai Semico... |
LM75B
|
312Kb / 23P |
plastic thin shrink small outline package; 8 leads;
|