DESCRIPTION
The
S3 A BF ~S 3MBF are available in SMBF p a ckage

FEATURES
 F or surface mounted applications
 Low profile package
 Glass Passivated Chip Junction
 Easy to pick and place
 Availabl e in SMBF p ackage

MECHANICAL DATA
 Case: SMBF
 Terminals: Solderable per MIL STD 750,
Method 2026
 Approx. Weigh t: 57mg / 0.002oz