ALPHA EF-8000 GL is a rosin-containing flux designed to provide the attributes of excellent solderability and reliability in general and high-density boards in both Lead-Free and eutectic tin/lead processes. It is designed to have low bridging on bottom side QFP’s with 144-168 leads as well as superior performance in hole-fill and solderballing. Additionally, it provides good lead free solder joint cosmetics with an evenly spread, tack free residue.

Features for Pb-Free
•Good hole-fill demonstrated by >96% yield on 10 mil holes.
•Low bridging performance on connectors.
•Good micro-solder ball performance in Lead-Free applications
•Pin testable
•Specifically designed for use on Cu-OSP PCBs

Benefits:
•Excellent Lead-Free soldering performance on various board finishes.
•Evenly spread, tack free residue.
•Capable for high density as well as general purpose Lead-Free soldering processes.
•Can be used in Pb free or Sn/Pb processes