Electrical Features
•Blocking voltage 750V
•Low VCEsat
•Low Switching Losses
•Low Qg and Crss
•Low Inductive Design
•Tvj op = 150°C
•Short-time extended Operation Temperature
Tvj op = 175°C

Mechanical Features
•4.2kV DC 1sec Insulation
•High Creepage and Clearance Distances
•Compact design
•High Power Density
•Direct Cooled Base Plate with Ribbon Bonds
•Guiding elements for PCB and cooler assembly
•Integrated NTC temperature sensor
•PressFIT Contact Technology
•RoHS compliant
•UL 94 V0 module frame

Description
The HybridPACKTM Drive is a very compact
six-pack module optimized for hybrid and electric
vehicles. The product FS770R08A6P2FB comes
with a flat baseplate and bonded cooling structure
and is a 750V/770A module derivate within the
HybridPACK Drive family. The power module
implements the new EDT2 IGBT generation, which
is an automotive Micro-Pattern Trench-Field-Stop
cell design optimized for electric drive train
applications. The chipset has benchmark current
density combined with short circuit ruggedness and
increased blocking voltage for reliable inverter
operation under harsh environmental conditions.
The EDT2 IGBTs also show excellent light load
power losses, which helps to improve system
efficiency over a real driving cycle. The EDT2 IGBT
was optimized for applications with switching
frequencies in the range of 10 kHz.
The new HybridPACKTM Drive power module family
comes with mechanical guiding elements
supporting easy assembly processes for customers.
Furthermore, the press-fit pins for the signal
terminals avoid additional time consuming selective
solder processes, which provides cost savings on
system level and increases system reliability. The
products in the HybridPACK Drive family with flat
baseplate FS660R08A6P2FB; PinFin baseplate
FS820R08A6P2B as well as the FS770R08A6P2B
derivate allow a very cost effective scaling for
different inverter power levels at a minimum inverter
design effort.