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CYW4373 Datasheet (PDF) - Infineon Technologies AG

CYW4373 Datasheet PDF - Infineon Technologies AG
Part # CYW4373
Download  CYW4373 Download
File Size   2465.05 Kbytes
Page   116 Pages
Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG
Description Single-Chip Dual Band WiFi IEEE 802.11 a/b/g/n/ac MAC/Baseband/Radio with Integrated Bluetooth 5.0

CYW4373 Datasheet (PDF)

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CYW4373 Datasheet PDF - Infineon Technologies AG

Part # CYW4373
Download  CYW4373 Click to download

File Size   2465.05 Kbytes
Page   116 Pages
Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG
Description Single-Chip Dual Band WiFi IEEE 802.11 a/b/g/n/ac MAC/Baseband/Radio with Integrated Bluetooth 5.0

CYW4373 Datasheet (HTML) - Infineon Technologies AG


CYW4373 Product details

Features
IEEE 802.11x Key Features
■ IEEE 802.11ac compliant.
■ Support for MCS8 VHT20 in 20 MHz channels for up to 86.7
Mbps data.
■ Single-stream spatial multiplexing up to 433.3 Mbps data
rate.
■ Supports 20, 40, and 80 MHz channels with optional
SGI (256 QAM modulation).
■ Full IEEE 802.11a/b/g/n legacy compatibility with enhanced
performance.
■ On-chip power amplifiers and low-noise amplifiers for both
bands.
■ Support for optional front-end modules (FEM) with external
PAs and LNAs.
■ Supports integrated T/R switch for 2.4 GHz band.
■ Supports RF front-end architecture with a single dual-band
antenna shared between Bluetooth and WLAN for lowest
system cost.
■ Shared Bluetooth and WLAN receive signal path eliminates
the need for an external power splitter while maintaining
excellent sensitivity for both Bluetooth and WLAN.
■ Supports IEEE 802.15.2 external coexistence interface to
optimize bandwidth utilization with other co-located wireless
technologies such as LTE or ZigBee.
■ Supports standard SDIO v3.0 (including DDR50 mode at
50 MHz and SDR104 mode at 208 MHz, 4-bit and 1-bit) interfaces.
■ Backward compatible with SDIO v2.0 host interfaces.
■ USB 2.0 high-speed (480 Mbps) with integrated USB hub.
■ Intergrated Arm Cortex R4 processor and with tightly coupled
memory for complete WLAN subsystem functionality and
minimizing the need to wake-up the applications processor
for standard WLAN functions. This allows for further minimization
of power consumption, while maintaining the ability to
field upgrade with future features. On-chip memory for WLAN
core includes 896 KB RAM and 896 KB ROM.
■ Integrated Arm Cortex M3 processor that runs software from
the Link Control (LC) to the Host Controller Interface (HCI)
layer for Bluetooth.The Arm core is paired with a memory unit
that contains 1088 KB of ROM and 384 KB of RAM.
■ OneDriver™ software architecture for easy migration from
existing embedded WLAN and Bluetooth devices as well as
future devices.
Bluetooth Key Features
■ Qualified for Bluetooth Core Specification 5.0 with all Bluetooth
4.2 optional features
❐ QDID: 102901
❐ Declaration ID: D035922
■ Bluetooth Class 1 or Class 2 transmitter operation.
■ Supports extended synchronous connections (eSCO), for
enhanced voice quality by allowing for retransmission of
dropped packets.
■ Adaptive frequency hopping (AFH) for reducing radio frequency
interference.
■ Interface support, host controller interface (HCI) using a highspeed
UART interface and PCM for audio data.
■ Low power consumption improves battery life of IoT and
embedded devices.
■ Supports multiple simultaneous Advanced Audio Distribution
Profiles (A2DP) for stereo sound.
■ Automatic frequency detection for standard crystal and
TCXO values.
■ Programmable dynamic power management
■ 6 Kbit OTP for storing board parameters.
■ GPIOs: 10.
■ 128-ball WLBGA package (4.51 mm × 5.43 mm, 0.4 mm
pitch).
■ Security:
❐ WPA and WPA2 (Personal) support for powerful encryption
and authentication.
❐ AES and TKIP in hardware for faster data encryption and
IEEE 802.11i compatibility.
❐ Reference WLAN subsystem provides Wi-Fi Protected
Setup (WPS).
■ Worldwide regulatory support: Global products supported
with worldwide homologated design.




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About Infineon Technologies AG


Infineon Technologies is a leading global semiconductor manufacturer that specializes in providing power management, security, and control solutions for a variety of industries such as automotive, industrial, and communication systems.
The company was founded in 1999 and is headquartered in Neubiberg, Germany.
Infineon offers a wide range of products including microcontrollers, power semiconductors, sensors, and other integrated circuits.
The company has a strong presence in the global market, with operations and facilities in various countries across the world.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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