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FS75R17W2E4P_B11 Datasheet (PDF) - Infineon Technologies AG
FS75R17W2E4P_B11 Datasheet PDF - Infineon Technologies AG
Part # FS75R17W2E4P_B11
Download  FS75R17W2E4P_B11 Download
File Size   613.86 Kbytes
Page   14 Pages
Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG
Description EasyPACK™ module with Trench/Fieldstop IGBT4 and emitter controlled 4 diode and PressFIT / NTC / TIM

FS75R17W2E4P_B11 Datasheet (PDF)

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FS75R17W2E4P_B11 Datasheet PDF - Infineon Technologies AG

Part # FS75R17W2E4P_B11
Download  FS75R17W2E4P_B11 Click to download

File Size   613.86 Kbytes
Page   14 Pages
Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG
Description EasyPACK™ module with Trench/Fieldstop IGBT4 and emitter controlled 4 diode and PressFIT / NTC / TIM

FS75R17W2E4P_B11 Datasheet (HTML) - Infineon Technologies AG


FS75R17W2E4P_B11 Product details

Features
• Electrical features
- VCES = 1700 V
- IC nom = 75 A / ICRM = 150 A
- Low switching losses
- Low VCE,sat
• Mechanical features
- Al2O3 substrate with low thermal resistance
- PressFIT contact technology
- Rugged mounting due to integrated mounting clamps
- Compact design
- Pre-applied thermal interface material




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About Infineon Technologies AG

Infineon Technologies is a leading global semiconductor manufacturer that specializes in providing power management, security, and control solutions for a variety of industries such as automotive, industrial, and communication systems.
The company was founded in 1999 and is headquartered in Neubiberg, Germany.
Infineon offers a wide range of products including microcontrollers, power semiconductors, sensors, and other integrated circuits.
The company has a strong presence in the global market, with operations and facilities in various countries across the world.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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