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CC2674P10 Datasheet (PDF) - Texas Instruments

CC2674P10 Datasheet PDF - Texas Instruments
Part # CC2674P10
Download  CC2674P10 Download
File Size   2217.66 Kbytes
Page   63 Pages
Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments
Description CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

CC2674P10 Datasheet (PDF)

Go To PDF Page Download Datasheet
CC2674P10 Datasheet PDF - Texas Instruments

Part # CC2674P10
Download  CC2674P10 Click to download

File Size   2217.66 Kbytes
Page   63 Pages
Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments
Description CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

CC2674P10 Datasheet (HTML) - Texas Instruments


CC2674P10 Product details

1 Features
Wireless microcontroller
• AEC-Q100 Grade 2 qualified for Automotive
applications
• Optimized 48-MHz Arm® Cortex®-M0+ processor
• 512 KB of in-system programmable flash
• 12 KB of ROM for bootloader and drivers
• 36 KB of ultra-low leakage SRAM. Full RAM
retention in standby mode
• 2.4 GHz RF transceiver compatible with
Bluetooth® 5.3 Low Energy
• Integrated balun
• Supports over-the-air upgrade (OTA)
• Serial Wire Debug (SWD)
Low power consumption
• MCU consumption:
– 2.6 mA active mode, CoreMark®
– 53 μA/MHz running CoreMark®
– < 710 nA standby mode, RTC, 36 KB RAM
– 165 nA shutdown mode, wake-up on pin
• Radio Consumption:
– 5.3 mA RX
– 5.1 mA TX at 0 dBm
– < 11.0 mA TX at +8 dBm
Wireless protocol support
• Bluetooth® 5.3 Low Energy
High-performance radio
• -102 dBm for Bluetooth® Low Energy 125 kbps
• -96.5 dBm for Bluetooth® Low Energy 1 Mbps
• Output power up to +8 dBm with temperature
compensation
Regulatory compliance
• Suitable for systems targeting compliance with
these standards:
– EN 300 328 (Europe)
– FCC CFR47 Part 15
– ARIB STD-T66 (Japan)
MCU peripherals
• 19 I/O Pads
– 2 IO pads SWD, muxed with GPIOs
– 2 IO pads LFXT, muxed with GPIOs
– 15 DIOs (analog or digital IOs)
• 3 × 16-bit and 1× 24-bit general-purpose timers,
quadrature decode mode support
• 12-bit ADC, 1.2 Msps with external reference, 267
ksps with internal reference, 8 external ADC inputs
• 1× low power comparator
• 1× UART
• 1× SPI
• 1× I2C
• Real-time clock (RTC)
• Integrated temperature and battery monitor
• Watchdog timer
Security enablers
• AES 128-bit cryptographic accelerator
• Random number generator from on-chip analog
noise
Development tools and software
• LP-EM-CC2340R5 LaunchPad Development Kit
• SimpleLink™ CC23xx Software Development Kit
(SDK)
• SmartRF™ Studio for simple radio configuration
• SysConfig system configuration tool
Operating range
• On-chip buck DC/DC converter
• 1.71-V to 3.8-V single supply voltage
• Tj: -40 to +125°C
• HBM ESD Classification Level 2
• CDM ESD Classification Level C3
RoHS-compliant package
• 5-mm × 5-mm RHB QFN32 with wettable flanks
(19 GPIOs)

2 Applications
• Automotive
– Car access and security systems
• Passive entry passive start (PEPS)
• Remote keyless entry (RKE)
– Advanced driver assistance systems (ADAS)
– Tire pressure monitoring systems (TPMS)

3 Description
The SimpleLink™ CC2340R5-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting
Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication
in applications such as tire pressure monitoring systems (TPMS), car access including key fogs used in passive
entry passive start (PEPS) and remote keyless entry (RKE), cable replacement, and smartphone connectivity.
The Highlighted features of this device include:
• Support for Bluetooth ® 5 features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and
500 kbps PHYs), Privacy 1.2.1 and Channel Selection Algorithm #2, as well as backwards compatibility and
support for key features from the Bluetooth ® 4.2 and earlier Low Energy specifications.
• Fully-qualified Bluetooth ® 5.3 software protocol stack included with the SimpleLink™ CC23xx Software
Development Kit (SDK).
• Ultra-low standby current less than 0.71 μA with RTC operational and full RAM retention that enables
significant battery life extension especially for applications with longer sleep intervals.
• Integrated balun for reduced Bill-of-Material (BOM) board layout.
• Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy
(-102 dBm for 125 kbps LE Coded PHY, with integrated balun).
The CC2340R5-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth Low
Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development
environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the
SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing
100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU
platform.




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About Texas Instruments


Texas Instruments (TI) is a publicly traded company that designs and manufactures semiconductor and computer technology products.

It was founded in 1930 and is headquartered in Dallas, Texas.

TI is a global leader in the production of analog and digital signal processing (DSP) integrated circuits, as well as embedded processors and other microcontroller products.

The company serves customers in a variety of industries, including automotive, communications, computing, industrial, and consumer electronics.

TI's product portfolio includes data converters, amplifiers and comparators, power management ICs, microcontrollers, sensors, and wireless connectivity solutions, among others.

TI is committed to innovation and customer satisfaction, and has a long history of delivering high-quality, reliable products to its customers.

With a focus on sustainability and energy efficiency, TI is dedicated to making a positive impact on the world through its technology and products.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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