125℃ TJ operation(VR<5V)
Unique high power, Half-Pak module
Optimized for OR-ing applications
High purity, high temperature epoxy encapsulation for enhanced
mechanical strength and moisture resistance
Ultra low forward voltage drop
High frequency operation
Guard ring for enhanced ruggedness and long term reliability
Base plate: Nickel plated; Terminals: Nickel plated
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request