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ETCSP Datasheet (PDF) - Amkor Technology

ETCSP Datasheet PDF - Amkor Technology
Part # ETCSP
Download  ETCSP Download

File Size   148.67 Kbytes
Page   2 Pages
Manufacturer  AMKOR [Amkor Technology]
Direct Link  http://www.amkor.com
Logo AMKOR - Amkor Technology
Description the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.

ETCSP Datasheet (PDF)

Go To PDF Page Download Datasheet
ETCSP Datasheet PDF - Amkor Technology

Part # ETCSP
Download  ETCSP Click to download

File Size   148.67 Kbytes
Page   2 Pages
Manufacturer  AMKOR [Amkor Technology]
Direct Link  http://www.amkor.com
Logo AMKOR - Amkor Technology
Description the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.

ETCSP Datasheet (HTML) - Amkor Technology

ETCSP Datasheet HTML 1Page - Amkor Technology ETCSP Datasheet HTML 2Page - Amkor Technology



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About Amkor Technology


Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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