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SN74LVC1G79DBVT Datasheet (PDF) - Texas Instruments

SN74LVC1G79DBVT Datasheet PDF - Texas Instruments
Part # SN74LVC1G79DBVT
Download  SN74LVC1G79DBVT Download
File Size   1042.48 Kbytes
Page   32 Pages
Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments
Description SN74LVC1G79 Single Positive-Edge-Triggered D-Type Flip-Flop

SN74LVC1G79DBVT Datasheet (PDF)

Go To PDF Page Download Datasheet
SN74LVC1G79DBVT Datasheet PDF - Texas Instruments

Part # SN74LVC1G79DBVT
Download  SN74LVC1G79DBVT Click to download

File Size   1042.48 Kbytes
Page   32 Pages
Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments
Description SN74LVC1G79 Single Positive-Edge-Triggered D-Type Flip-Flop

SN74LVC1G79DBVT Datasheet (HTML) - Texas Instruments


SN74LVC1G79DBVT Product details

1 Features
1• Available in the Texas Instruments
NanoFree™ Package
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Supports Down Translation to VCC
• Max tpd of 6 ns at 3.3 V and 50 pF load
• Low Power Consumption, 10-μA Max ICC
• ±24-mA Output Drive at 3.3 V
• Ioff supports Partial-Power-Down Mode and Back-
Drive Protection

2 Applications
• Test and Measurement
• Enterprise Switching
• Telecom Infrastructure
• Personal Electronics
• White Goods

3 Description
The SN74LVC1G79 device is a single positive-edgetriggered
D-type flip-flop that is designed for 1.65-V to
5.5-V VCC operation.
When data at the data (D) input meets the setup time
requirement, the data is transferred to the Q output
on the positive-going edge of the clock pulse. Clock
triggering occurs at a voltage level and is not directly
related to the rise time of the clock pulse. Following
the hold-time interval, data at the D input can be
changed without affecting the level at the output.
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs when the device is powered down. This
inhibits current backflow into the device which
prevents damage to the device.




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