1 Features
1• Small-size VSSOP Packages Save Board Space,
or SOIC for Drop-in Compatibility
• Bus I/O Protection
– >±15 kV HBM Protection
– >±12 kV IEC 61000-4-2 Contact Discharge
– >±4 kV IEC 61000-4-4 Fast Transient Burst
• Extended Industrial Temperature Range
–40°C to 125°C
• Large Receiver Hysteresis (80 mV) for Noise
Rejection
• Low Unit-Loading Allows Over 200 Connected
Nodes
• Low Power Consumption
– Low Standby Supply Current: < 2 μA
– ICC < 1 mA Quiescent During Operation
• 5-V Tolerant Logic Inputs Compatible With
3.3-V or 5-V Controllers
• Signaling Rate Options Optimized for:
250 kbps, 20 Mbps, 50 Mbps
• Glitch Free Power-Up and Power-Down Bus
Inputs and Outputs

2 Applications
• Factory Automation
• Telecommunications Infrastructure
• Motion Control

3 Description
These devices have robust 3.3-V drivers and
receivers in a small package for demanding industrial
applications. The bus pins are robust to ESD events
with high levels of protection to Human-Body Model
and IEC Contact Discharge specifications.
Each of these devices combines a differential driver
and a differential receiver which operate from a single
3.3-V power supply. The driver differential outputs
and the receiver differential inputs are connected
internally to form a bus port suitable for half-duplex
(two-wire bus) communication. These devices feature
a wide common-mode voltage range making the
devices suitable for multi-point applications over long
cable runs. These devices are characterized from
–40°C to 125°C.