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SN74LVC1G175DBVR Datasheet (PDF) - Texas Instruments

SN74LVC1G175DBVR Datasheet PDF - Texas Instruments
Part # SN74LVC1G175DBVR
Download  SN74LVC1G175DBVR Download
File Size   1794.12 Kbytes
Page   32 Pages
Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments
Description SN74LVC1G175 Single D-Type Flip-Flop With Asynchronous Clear

SN74LVC1G175DBVR Datasheet (PDF)

Go To PDF Page Download Datasheet
SN74LVC1G175DBVR Datasheet PDF - Texas Instruments

Part # SN74LVC1G175DBVR
Download  SN74LVC1G175DBVR Click to download

File Size   1794.12 Kbytes
Page   32 Pages
Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments
Description SN74LVC1G175 Single D-Type Flip-Flop With Asynchronous Clear

SN74LVC1G175DBVR Datasheet (HTML) - Texas Instruments


SN74LVC1G175DBVR Product details

1 Features
1• Available in the Texas Instruments
NanoFree™ Package
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Supports Down Translation to VCC
• Max tpd of 4.3 ns at 3.3 V
• Low Power Consumption, 10-μA Max ICC
• ±24-mA Output Drive at 3.3 V
• Ioff Supports Live Insertion, Partial-Power-Down
Mode, and Back-Drive Protection
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)

2 Applications
• TV/Set Top Box/Audio
• EPOS (Electronic Point-of-Sale)
• Motor Drives
• PC/Notebook
• Servers
• Factory Automation and Control
• Tablets
• Medical Healthcare and Fitness
• Smart Grid
• Telecom Infrastructure
• Enterprise Switching
• Projectors
• Storage

3 Description
This single D-type flip-flop is designed for 1.65-V to
5.5-V VCC operation.
The SN74LVC1G175 device has an asynchronous
clear (CLR) input. When CLR is high, data from the input pin (D) is transferred to the output pin (Q) on
the clock's (CLK) rising edge. When CLR is low, Q is
forced into the low state, regardless of the clock edge
or data on D.
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the device when it is powered down.




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