1 Features
• –40°C to +150°C operating junction temperature
range
• Integrated 8-mΩ and 6-mΩ MOSFETs
• Thermally-enhanced 3.5-mm × 3.5-mm HotRod™
package
• Peak-current-mode control
• Eco-mode™ pulse skip for higher efficiency
• Overcurrent protection for both MOSFETs
• Selectable overcurrent protection schemes
• Selectable overcurrent protection levels
• Split power rail: 1.6 V to 17 V on PVIN
• 0.6-V voltage reference with ±1% accuracy
• 200-kHz to 1.2-MHz switching frequency
• Synchronizes to external clock
• Start-up into prebiased outputs
• Overtemperature and overvoltage protection
• Adjustable soft start and power sequencing
• Power-good output monitor for undervoltage and
overvoltage
• SYNC_OUT function provides output clock signal
180° out-of-phase
• For SWIFT™ documentation and WEBENCH, visit
http://www.ti.com/swift
• Create a custom design using the TPS54020 with
the WEBENCH® Power Designer

2 Applications
• Wireless infrastructure and wired communications
equipment
• Test and measurement
• Aerospace and defense
• DSP and FPGA point-of-load industrial
applications

3 Description
The TPS54020 is a 10-A, 4.5-V to 17-V input SWIFT
converter. The innovative 3.5-mm × 3.5-mm HotRod
package optimizes high-density step-down designs.
The TPS54020 is a full-featured converter.
High efficiency is achieved through the innovative
integration and packaging of the high-side and lowside
MOSFETs. The TPS54020 operates at
continuous current mode (CCM) at higher load
conditions, and transitions to Eco-mode while skipping
pulses to boost the efficiency at light loads.
Current limiting on both MOSFETs provides device
and system protection. Cycle-by-cycle current limiting
in the high-side MOSFET protects for overload
situations. Low-side MOSFET zero current detection
turns off the low-side MOSFET while operating under
light loads. Three selectable current-limit thresholds
allow a good fit for various applications. A hiccup or
cycle-by-cycle overcurrent protection scheme is also
selectable.
Thermal shutdown protection disables switching when
die temperature exceeds the thermal shutdown trip
point and enables switching after the built-in thermal
hysteresis and shutdown hiccup time.