Board features
The FRDM-HB2000ESEVM board evaluates the NXP part MC33HB2000, including all
functions. The board features the following:
• Built-in reverse battery protection
• Test points that allow signal probing
• Built-in voltage regulator to supply logic level circuitry
• Current feedback network for real-time load current monitoring by MCU
analog‑to‑digital converter (ADC)
• LEDs to indicate the supply status and the direction of the motor
• Low equivalent series resistance (ESR) capacitor to reduce ripple in the power supply
• Transient voltage suppressor to handle system level transients
Features
• Advanced diagnostic reporting via a serial peripheral
interface (SPI): charge pump undervoltage on VPWR,
short to ground and short to VPWR for each output,
open load, temperature warning, and overtemperature
shutdown
• Thermal management: excellent thermal resistance of
< 1.0 °C/W between junction and case (exposed pad)
• Eight selectable slew rates via the SPI: 0.25 V/μs to
more than 16 V/μs for electromagnetic interference
(EMI) and thermal performance optimization
• Four selectable current limits via the SPI: 5.4 A, 7.0 A,
8.8 A, 10.7 A, covering a wide range of applications
• Can be operated without the SPI with a default slew
rate of 2.0 V/μs and a 7.0 A current limit threshold
• Highly accurate real-time current feedback through a
current mirror output signal with less than 5.0 % error
• Drives inductive loads in a full H-Bridge or Half-Bridge
configuration
• Overvoltage protection places the load in high‑side
recirculation (braking) mode with notification in
H‑Bridge mode
• Wide operating range: 5.0 V to 28 V operation
• Low RDS(on) integrated metal‑oxide‑semiconductor
field‑effect transistors (MOSFETs): Maximum of
235 mΩ (TJ = 150 °C) for each MOSFET
• Internal protection for overtemperature, undervoltage,
and short-circuit by signaling the error condition and
disabling the outputs
• I/O pins can withstand up to 36 V