FEATURES
• Power pack
• Glass passivated pellet chip junction
• Ultrafast recovery time
• Low switching losses, high efficiency
• Low forward voltage drop
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum peak of
   245 °C (for TO-263AB package)
• Solder dip 275 °C max. 10 s, per JESD 22-B106
   (for TO-220AC and ITO-220AC package)
• AEC-Q101 qualified
   (for ITO-220AC and TO-263AB package)
• Material categorization: for definitions of compliance
   please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS
   For use in high frequency rectifier of switching mode
   power supplies, inverters, freewheeling diodes, DC/DC
   converters, and other power switching application.